Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | R-XDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 0 |
| Filter level | 38535Q/M;38534H;883B |
| speed | 16 MHz |
| Maximum slew rate | 39 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |

| 80C32-16/BQA | 80C52-12/BMA | 80C52-16/BQA | 80C32-12/BMA | 80C52/BQA | 80C32/BQA | 80C32-16/BMA | 80C52-16/BMA | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CQCC44, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | R-XDIP-T40 | S-XQCC-J44 | R-XDIP-T40 | S-XQCC-J44 | R-XDIP-T40 | R-XDIP-T40 | S-XQCC-J44 | S-XQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 44 | 40 | 44 | 40 | 40 | 44 | 44 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCJ | DIP | QCCJ | DIP | DIP | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| speed | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | 16 MHz | 16 MHz |
| Maximum slew rate | 39 mA | 35 mA | 39 mA | 35 mA | 39 mA | 39 mA | 39 mA | 39 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |