N74LS155F datasheet, PDF - EEWORLD Datasheet

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N74LS155F: DescriptionDecoder/Driver, TTL, CDIP16; Categorylogic logic; File Size202KB，4 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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N74LS155F Overview

Decoder/Driver, TTL, CDIP16

N74LS155F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	OTHER DECODER/DRIVER
Number of functions	2
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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N74LS155F Related Products

	N74LS155F	N74155B	S54155F	N74155F	S54155W	S54155W/883B	S54155F/883B
Description	Decoder/Driver, TTL, CDIP16	Decoder/Driver, TTL, PDIP16	Decoder/Driver, TTL, CDIP16	Decoder/Driver, TTL, CDIP16	Decoder/Driver, TTL, CDFP16	Decoder/Driver, TTL, CDFP16	Decoder/Driver, TTL, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	DFP, FL16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	R-XDFP-F16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
Number of functions	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	125 °C	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-55 °C	-	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DFP	DFP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	FL16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	FLATPACK	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
MaximumI(ol)	-	0.016 A	0.016 A	0.016 A	0.016 A	0.016 A	0.016 A
Maximum supply current (ICC)	-	40 mA	35 mA	40 mA	35 mA	35 mA	35 mA
Prop。Delay @ Nom-Sup	-	32 ns	32 ns	32 ns	32 ns	32 ns	-

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