EBD10RD4ABFA-6B datasheet, PDF

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EBD10RD4ABFA-6B: Description1GB Registered DDR SDRAM DIMM; Categorystorage storage; File Size190KB，19 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en

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EBD10RD4ABFA-6B Overview

1GB Registered DDR SDRAM DIMM

EBD10RD4ABFA-6B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ELPIDA
Parts packaging code	DIMM
package instruction	DIMM, DIMM184
Contacts	184
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.7 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N184
memory density	9663676416 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	184
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM184
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.52 A
Maximum slew rate	8.025 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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PRELIMINARY DATA SHEET

1GB Registered DDR SDRAM DIMM

EBD10RD4ABFA

(128M words

72 bits, 1 Rank)

Description

The EBD10RD4ABFA is 128M words

72 bits, 1 rank

Double Data Rate (DDR) SDRAM registered module,

mounting 18 pieces of 512M bits DDR SDRAM sealed

in TSOP package. Read and write operations are

performed at the cross points of the CK and the /CK.

This high-speed data transfer is realized by the 2-bit

prefetch-pipelined architecture. Data strobe (DQS)

both for read and write are available for high speed and

reliable data bus design. By setting extended mode

set enable or disable. This module provides high

density mounting without utilizing surface mount

technology.

Decoupling capacitors are mounted

beside each TSOP on the module board.

Features

•

184-pin socket type dual in line memory module

(DIMM)



PCB height: 30.48mm



Lead pitch: 1.27mm

•

2.5V power supply

•

Data rate: 333Mbps/266Mbps (max.)

•

2.5 V (SSTL_2 compatible) I/O

•

Double Data Rate architecture; two data transfers per

clock cycle

•

Bi-directional, data strobe (DQS) is transmitted

/received with data, to be used in capturing data at

the receiver

•

Data inputs and outputs are synchronized with DQS

•

4 internal banks for concurrent operation

(Component)

•

DQS is edge aligned with data for READs; center

aligned with data for WRITEs

•

Differential clock inputs (CK and /CK)

•

DLL aligns DQ and DQS transitions with CK

transitions

•

Commands entered on each positive CK edge; data

referenced to both edges of DQS

•

Auto precharge option for each burst access

•

Programmable burst length: 2, 4, 8

•

Programmable /CAS latency (CL): 2, 2.5

•

Refresh cycles: (8192 refresh cycles /64ms)



7.8µs maximum average periodic refresh interval

•

2 variations of refresh



Auto refresh



Self refresh

•

1 piece of PLL clock driver, 2 pieces of register driver

and 1 piece of serial EEPROM (2k bits) for Presence

Detect (SPD) on PCB.

Document No. E0274E40 (Ver. 4.0)

Date Published April 2003 (K) Japan

URL: http://www.elpida.com

Elpida

Memory,Inc. 2002-2003

EBD10RD4ABFA-6B Related Products

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Description	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM	1GB Registered DDR SDRAM DIMM
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	-
Maker	ELPIDA	ELPIDA	ELPIDA	-	ELPIDA	ELPIDA	ELPIDA	-
Parts packaging code	DIMM	DIMM	DIMM	-	DIMM	DIMM	DIMM	-
package instruction	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184	-	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184	-
Contacts	184	184	184	-	184	184	184	-
Reach Compliance Code	unknown	unknow	unknown	-	unknow	unknow	unknow	-
ECCN code	EAR99	EAR99	EAR99	-	EAR99	EAR99	EAR99	-
access mode	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	-	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	-
Maximum access time	0.7 ns	0.75 ns	0.7 ns	-	0.75 ns	0.75 ns	0.75 ns	-
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-
Maximum clock frequency (fCLK)	166 MHz	166 MHz	133 MHz	-	133 MHz	142 MHz	133 MHz	-
I/O type	COMMON	COMMON	COMMON	-	COMMON	COMMON	COMMON	-
JESD-30 code	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	-	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	-
memory density	9663676416 bit	9663676416 bi	9663676416 bit	-	9663676416 bi	9663676416 bi	9663676416 bi	-
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	-
memory width	72	72	72	-	72	72	72	-
Number of functions	1	1	1	-	1	1	1	-
Number of ports	1	1	1	-	1	1	1	-
Number of terminals	184	184	184	-	184	184	184	-
word count	134217728 words	134217728 words	134217728 words	-	134217728 words	134217728 words	134217728 words	-
character code	128000000	128000000	128000000	-	128000000	128000000	128000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	70 °C	-	70 °C	70 °C	70 °C	-
organize	128MX72	128MX72	128MX72	-	128MX72	128MX72	128MX72	-
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	-
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-
encapsulated code	DIMM	DIMM	DIMM	-	DIMM	DIMM	DIMM	-
Encapsulate equivalent code	DIMM184	DIMM184	DIMM184	-	DIMM184	DIMM184	DIMM184	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-
power supply	2.5 V	2.5 V	2.5 V	-	2.5 V	2.5 V	2.5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	8192	8192	8192	-	8192	8192	8192	-
self refresh	YES	YES	YES	-	YES	YES	YES	-
Maximum standby current	0.52 A	0.444 A	0.444 A	-	0.454 A	0.444 A	0.454 A	-
Maximum slew rate	8.025 mA	4.26 mA	4.89 mA	-	6.88 mA	4.26 mA	6.88 mA	-
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V	-
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	-	2.3 V	2.3 V	2.3 V	-
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	-	2.5 V	2.5 V	2.5 V	-
surface mount	NO	NO	NO	-	NO	NO	NO	-
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal form	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	-
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	-

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