AM9864-30/BUC datasheet, PDF - EEWORLD Datasheet

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AM9864-30/BUC: DescriptionEEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32; Categorystorage storage; File Size270KB，10 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM9864-30/BUC Overview

EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32

AM9864-30/BUC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	QFJ
package instruction	QCCN, LCC32,.45X.55
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	300 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
ready/busy	YES
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.54 mm
Maximum standby current	0.07 A
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	NMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
width	11.43 mm
Base Number Matches	1

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Description	EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	EEPROM, 8KX8, 350ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 250ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	EEPROM, 8KX8, 300ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	EEPROM, 8KX8, 300ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	EEPROM, 8KX8, 250ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFJ	DIP	QFJ	DIP	QFJ	DIP	DIP	DIP	DIP
package instruction	QCCN, LCC32,.45X.55	DIP, DIP28,.6	QCCN, LCC32,.45X.55	DIP, DIP28,.6	QCCN, LCC32,.45X.55	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Contacts	32	28	32	28	32	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	300 ns	350 ns	350 ns	350 ns	250 ns	250 ns	300 ns	300 ns	250 ns
command user interface	NO	NO	NO	NO	NO	NO	NO	NO	NO
Data polling	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	37.1475 mm	13.97 mm	37.1475 mm	13.97 mm	37.1475 mm	37.1475 mm	37.1475 mm	37.1475 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	28	32	28	32	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	QCCN	DIP	QCCN	DIP	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES	YES
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	2.54 mm	5.588 mm	2.54 mm	5.588 mm	2.54 mm	5.588 mm	5.588 mm	5.588 mm	5.588 mm
Maximum standby current	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	YES	NO	NO	NO	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
switch bit	NO	NO	NO	NO	NO	NO	NO	NO	NO
width	11.43 mm	15.24 mm	11.43 mm	15.24 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Maker	AMD	AMD	AMD	AMD	-	-	AMD	AMD	AMD
Base Number Matches	1	1	1	1	1	1	-	-	-

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