74LV138DB-T datasheet, PDF - EEWORLD Datasheet

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74LV138DB-T: DescriptionDecoder/Driver, CMOS, PDSO16,; Categorylogic logic; File Size421KB，10 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/; Environmental Compliance

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74LV138DB-T Overview

Decoder/Driver, CMOS, PDSO16,

74LV138DB-T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	SSOP, SSOP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.006 A
Humidity sensitivity level	1
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP16,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
method of packing	TAPE AND REEL
power supply	3.3 V
Prop。Delay @ Nom-Sup	32 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL
Base Number Matches	1

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74LV138DB-T Related Products

	74LV138DB-T	74LV138D-T	74LV138PW-T
Description	Decoder/Driver, CMOS, PDSO16,	Decoder/Driver, CMOS, PDSO16,	Decoder/Driver, CMOS, PDSO16,
Is it Rohs certified?	conform to	conform to	conform to
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	SSOP, SSOP16,.3	SOP, SOP16,.25	TSSOP, TSSOP16,.25
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
MaximumI(ol)	0.006 A	0.006 A	0.006 A
Number of functions	1	1	1
Number of terminals	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SOP	TSSOP
Encapsulate equivalent code	SSOP16,.3	SOP16,.25	TSSOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
power supply	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	32 ns	32 ns	32 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.635 mm	1.27 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL
Base Number Matches	1	1	1
Humidity sensitivity level	1	1	-

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