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73K224L

Description
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
File Size209KB,32 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
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73K224L Overview

V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem

73K224L
V.22bis/V.22/V.21/ Bell 212A/Bell 103
Single-Chip Modem
April 2000
DESCRIPTION
The 73K224L is a highly integrated single-chip
modem IC which provides the functions needed to
construct a V.22bis compatible modem, capable of
2400 bit/s full-duplex operation over dial-up lines. The
73K224L offers excellent performance and a high
level of functional integration in a single 28-pin DIP
and 44-pin TQFP package. This device supports
V.22bis, V.22, V.21, Bell 212A and Bell 103 modes of
operation,
allowing
both
synchronous
and
asynchronous communication. The 73K224L is
designed to appear to the systems designer as a
microprocessor peripheral, and will easily interface
with popular single-chip microprocessors (80C51
typical) for control of modem functions through its 8-
bit multiplexed address/data bus or via an optional
serial control bus. An ALE control line simplifies
address demultiplexing.
Data
communications
normally occur through a separate serial port. The
73K224L is pin and software compatible with the
73K212L and 73K222L single-chip modem ICs,
allowing system upgrades with a single component
change.
The 73K224L operates from a single +5V supply for
low power consumption.
The 73K224L is ideal for use in either free-standing or
integral system modem products where full-duplex
(continued)
FEATURES
One-chip multi-mode V.22bis/V.22/V.21 and Bell
212A/103 compatible modem data pump
FSK (300 bit/s), DPSK (600, 1200 bit/s), or QAM
(2400 bit/s) encoding
Pin and software compatible with other TDK
Semiconductor
Corporation
K-Series
1-chip
modems
Interfaces directly with standard microcontrollers
(80C51 typical)
Parallel microcontroller bus for modem control and
status monitoring functions
Selectable
asynch/synch
with
internal
buffer/debuffer
and
scrambler/descrambler
functions
All synchronous and asynchronous operating
modes (internal, external, slave)
Adaptive equalization for optimum performance
over all lines
Programmable transmit attenuation (16 dB, 1 dB
steps), selectable receive boost (+18 dB)
Call progress, carrier, answer tone, unscrambled
mark, S1, and signal quality monitors
DTMF, answer and guard tone generators
Test modes available: ALB, DL, RDL, Mark, Space,
Alternating bit, S1 pattern
CMOS technology for low power consumption
(typically 100 mW @ 5V) with power-down mode
(15 mW @ 5V)
TTL and CMOS compatible inputs and outputs
BLOCK DIAGRAM

73K224L Related Products

73K224L 73K224L-IGT 73K224L-28IH 73K224L-IP 73K224L-IH
Description V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
Maker - TDK Corporation - TDK Corporation TDK Corporation
Parts packaging code - QFP QLCC DIP QLCC
package instruction - LQFP, QCCJ, DIP, DIP28,.6 QCCJ, LDCC28,.5SQ
Contacts - 44 28 28 28
Reach Compliance Code - unknown unknow unknown unknown
Other features - DATA RATE MIN:300BPS FULL DUPLEX FULL DUPLEX DATA RATE MIN:300BPS
data rate - 2.4 Mbps 2.4 Mbps 2.4 Mbps 2.4 Mbps
JESD-30 code - S-PQFP-G44 S-PQCC-J28 R-PDIP-T28 S-PQCC-J28
length - 14 mm 11.5062 mm 35.941 mm 11.5062 mm
Number of functions - 1 1 1 1
Number of terminals - 44 28 28 28
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LQFP QCCJ DIP QCCJ
Package shape - SQUARE SQUARE RECTANGULAR SQUARE
Package form - FLATPACK, LOW PROFILE CHIP CARRIER IN-LINE CHIP CARRIER
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.45 mm 4.572 mm 5.588 mm 4.572 mm
Nominal supply voltage - 5 V 5 V 5 V 5 V
surface mount - YES YES NO YES
technology - CMOS CMOS CMOS CMOS
Telecom integrated circuit types - MODEM MODEM MODEM MODEM
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - GULL WING J BEND THROUGH-HOLE J BEND
Terminal pitch - 1 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location - QUAD QUAD DUAL QUAD
width - 14 mm 11.5062 mm 15.24 mm 11.5062 mm
Base Number Matches - 1 1 - 1
Maximum slew rate - - 25 mA 25 mA 0.025 mA

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