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73K224L-IP

Description
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
CategoryWireless rf/communication    Telecom circuit   
File Size209KB,32 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
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73K224L-IP Overview

V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem

73K224L-IP Parametric

Parameter NameAttribute value
MakerTDK Corporation
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknown
Other featuresFULL DUPLEX
data rate2.4 Mbps
JESD-30 codeR-PDIP-T28
length35.941 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum slew rate25 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
73K224L
V.22bis/V.22/V.21/ Bell 212A/Bell 103
Single-Chip Modem
April 2000
DESCRIPTION
The 73K224L is a highly integrated single-chip
modem IC which provides the functions needed to
construct a V.22bis compatible modem, capable of
2400 bit/s full-duplex operation over dial-up lines. The
73K224L offers excellent performance and a high
level of functional integration in a single 28-pin DIP
and 44-pin TQFP package. This device supports
V.22bis, V.22, V.21, Bell 212A and Bell 103 modes of
operation,
allowing
both
synchronous
and
asynchronous communication. The 73K224L is
designed to appear to the systems designer as a
microprocessor peripheral, and will easily interface
with popular single-chip microprocessors (80C51
typical) for control of modem functions through its 8-
bit multiplexed address/data bus or via an optional
serial control bus. An ALE control line simplifies
address demultiplexing.
Data
communications
normally occur through a separate serial port. The
73K224L is pin and software compatible with the
73K212L and 73K222L single-chip modem ICs,
allowing system upgrades with a single component
change.
The 73K224L operates from a single +5V supply for
low power consumption.
The 73K224L is ideal for use in either free-standing or
integral system modem products where full-duplex
(continued)
FEATURES
One-chip multi-mode V.22bis/V.22/V.21 and Bell
212A/103 compatible modem data pump
FSK (300 bit/s), DPSK (600, 1200 bit/s), or QAM
(2400 bit/s) encoding
Pin and software compatible with other TDK
Semiconductor
Corporation
K-Series
1-chip
modems
Interfaces directly with standard microcontrollers
(80C51 typical)
Parallel microcontroller bus for modem control and
status monitoring functions
Selectable
asynch/synch
with
internal
buffer/debuffer
and
scrambler/descrambler
functions
All synchronous and asynchronous operating
modes (internal, external, slave)
Adaptive equalization for optimum performance
over all lines
Programmable transmit attenuation (16 dB, 1 dB
steps), selectable receive boost (+18 dB)
Call progress, carrier, answer tone, unscrambled
mark, S1, and signal quality monitors
DTMF, answer and guard tone generators
Test modes available: ALB, DL, RDL, Mark, Space,
Alternating bit, S1 pattern
CMOS technology for low power consumption
(typically 100 mW @ 5V) with power-down mode
(15 mW @ 5V)
TTL and CMOS compatible inputs and outputs
BLOCK DIAGRAM

73K224L-IP Related Products

73K224L-IP 73K224L 73K224L-IGT 73K224L-28IH 73K224L-IH
Description V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
Maker TDK Corporation - TDK Corporation - TDK Corporation
Parts packaging code DIP - QFP QLCC QLCC
package instruction DIP, DIP28,.6 - LQFP, QCCJ, QCCJ, LDCC28,.5SQ
Contacts 28 - 44 28 28
Reach Compliance Code unknown - unknown unknow unknown
Other features FULL DUPLEX - DATA RATE MIN:300BPS FULL DUPLEX DATA RATE MIN:300BPS
data rate 2.4 Mbps - 2.4 Mbps 2.4 Mbps 2.4 Mbps
JESD-30 code R-PDIP-T28 - S-PQFP-G44 S-PQCC-J28 S-PQCC-J28
length 35.941 mm - 14 mm 11.5062 mm 11.5062 mm
Number of functions 1 - 1 1 1
Number of terminals 28 - 44 28 28
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - LQFP QCCJ QCCJ
Package shape RECTANGULAR - SQUARE SQUARE SQUARE
Package form IN-LINE - FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 5.588 mm - 1.45 mm 4.572 mm 4.572 mm
Maximum slew rate 25 mA - - 25 mA 0.025 mA
Nominal supply voltage 5 V - 5 V 5 V 5 V
surface mount NO - YES YES YES
technology CMOS - CMOS CMOS CMOS
Telecom integrated circuit types MODEM - MODEM MODEM MODEM
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE - GULL WING J BEND J BEND
Terminal pitch 2.54 mm - 1 mm 1.27 mm 1.27 mm
Terminal location DUAL - QUAD QUAD QUAD
width 15.24 mm - 14 mm 11.5062 mm 11.5062 mm
Base Number Matches - - 1 1 1

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