73K224L-IH datasheet, PDF - EEWORLD Datasheet

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73K224L-IH: DescriptionV.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem; CategoryWireless rf/communication Telecom circuit; File Size209KB，32 Pages; ManufacturerTDK Corporation; Websitehttp://www.tdk.com

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73K224L-IH Overview

V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem

73K224L-IH Parametric

Parameter Name	Attribute value
Maker	TDK Corporation
Parts packaging code	QLCC
package instruction	QCCJ, LDCC28,.5SQ
Contacts	28
Reach Compliance Code	unknown
Other features	DATA RATE MIN:300BPS
data rate	2.4 Mbps
JESD-30 code	S-PQCC-J28
length	11.5062 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC28,.5SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum slew rate	0.025 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.5062 mm
Base Number Matches	1

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73K224L

V.22bis/V.22/V.21/ Bell 212A/Bell 103

Single-Chip Modem

April 2000

DESCRIPTION

The 73K224L is a highly integrated single-chip

modem IC which provides the functions needed to

construct a V.22bis compatible modem, capable of

2400 bit/s full-duplex operation over dial-up lines. The

73K224L offers excellent performance and a high

level of functional integration in a single 28-pin DIP

and 44-pin TQFP package. This device supports

V.22bis, V.22, V.21, Bell 212A and Bell 103 modes of

operation,

allowing

both

synchronous

and

asynchronous communication. The 73K224L is

designed to appear to the systems designer as a

microprocessor peripheral, and will easily interface

with popular single-chip microprocessors (80C51

typical) for control of modem functions through its 8-

bit multiplexed address/data bus or via an optional

serial control bus. An ALE control line simplifies

address demultiplexing.

Data

communications

normally occur through a separate serial port. The

73K224L is pin and software compatible with the

73K212L and 73K222L single-chip modem ICs,

allowing system upgrades with a single component

change.

The 73K224L operates from a single +5V supply for

low power consumption.

The 73K224L is ideal for use in either free-standing or

integral system modem products where full-duplex

(continued)

FEATURES

•

One-chip multi-mode V.22bis/V.22/V.21 and Bell

212A/103 compatible modem data pump

FSK (300 bit/s), DPSK (600, 1200 bit/s), or QAM

(2400 bit/s) encoding

Pin and software compatible with other TDK

Semiconductor

Corporation

K-Series

1-chip

modems

Interfaces directly with standard microcontrollers

(80C51 typical)

Parallel microcontroller bus for modem control and

status monitoring functions

Selectable

asynch/synch

with

internal

buffer/debuffer

and

scrambler/descrambler

functions

All synchronous and asynchronous operating

modes (internal, external, slave)

Adaptive equalization for optimum performance

over all lines

Programmable transmit attenuation (16 dB, 1 dB

steps), selectable receive boost (+18 dB)

Call progress, carrier, answer tone, unscrambled

mark, S1, and signal quality monitors

DTMF, answer and guard tone generators

Test modes available: ALB, DL, RDL, Mark, Space,

Alternating bit, S1 pattern

CMOS technology for low power consumption

(typically 100 mW @ 5V) with power-down mode

(15 mW @ 5V)

TTL and CMOS compatible inputs and outputs

BLOCK DIAGRAM

73K224L-IH Related Products

	73K224L-IH	73K224L	73K224L-IGT	73K224L-28IH	73K224L-IP
Description	V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem	V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem	V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem	V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem	V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
Maker	TDK Corporation	-	TDK Corporation	-	TDK Corporation
Parts packaging code	QLCC	-	QFP	QLCC	DIP
package instruction	QCCJ, LDCC28,.5SQ	-	LQFP,	QCCJ,	DIP, DIP28,.6
Contacts	28	-	44	28	28
Reach Compliance Code	unknown	-	unknown	unknow	unknown
Other features	DATA RATE MIN:300BPS	-	DATA RATE MIN:300BPS	FULL DUPLEX	FULL DUPLEX
data rate	2.4 Mbps	-	2.4 Mbps	2.4 Mbps	2.4 Mbps
JESD-30 code	S-PQCC-J28	-	S-PQFP-G44	S-PQCC-J28	R-PDIP-T28
length	11.5062 mm	-	14 mm	11.5062 mm	35.941 mm
Number of functions	1	-	1	1	1
Number of terminals	28	-	44	28	28
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	-	LQFP	QCCJ	DIP
Package shape	SQUARE	-	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	-	FLATPACK, LOW PROFILE	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	-	1.45 mm	4.572 mm	5.588 mm
Maximum slew rate	0.025 mA	-	-	25 mA	25 mA
Nominal supply voltage	5 V	-	5 V	5 V	5 V
surface mount	YES	-	YES	YES	NO
technology	CMOS	-	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	-	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	J BEND	-	GULL WING	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	-	1 mm	1.27 mm	2.54 mm
Terminal location	QUAD	-	QUAD	QUAD	DUAL
width	11.5062 mm	-	14 mm	11.5062 mm	15.24 mm
Base Number Matches	1	-	1	1	-

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