74HCT181 datasheet, PDF - EEWORLD Datasheet

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74HCT181: Description4-bit arithmetic logic unit; File Size131KB，20 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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74HCT181 Overview

4-bit arithmetic logic unit

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INTEGRATED CIRCUITS

DATA SHEET

For a complete data sheet, please also download:

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The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

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The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

74HC/HCT181

4-bit arithmetic logic unit

Product speciﬁcation

Supersedes data of September 1993

File under Integrated Circuits, IC06

1998 Jun 10

74HCT181 Related Products

	74HCT181	74HC181	74HC181D	74HC181N	74HC181N3	74HCT181D	74HCT181N	74HCT181N3
Description	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	-	-	SOP, SOP24,.4	DIP, DIP24,.6	DIP, DIP24,.3	SOP, SOP24,.4	DIP, DIP24,.6	DIP, DIP24,.3
Reach Compliance Code	-	-	unknow	unknow	unknow	unknow	unknow	unknow
JESD-30 code	-	-	R-PDSO-G24	R-PDIP-T24	R-PDIP-T24	R-PDSO-G24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	-	-	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	-	-	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT
Number of terminals	-	-	24	24	24	24	24	24
Maximum operating temperature	-	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	SOP	DIP	DIP	SOP	DIP	DIP
Encapsulate equivalent code	-	-	SOP24,.4	DIP24,.6	DIP24,.3	SOP24,.4	DIP24,.6	DIP24,.3
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	-	-	2/6 V	2/6 V	2/6 V	5 V	5 V	5 V
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	-	-	YES	NO	NO	YES	NO	NO
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	-	-	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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