Telecom Circuit, PDIP8,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| NE5212N | 5212/BPA | NE5212AD-T | SA5212N | SE5212FE | SA5212D8 | SE5212N | SA5212FE | |
|---|---|---|---|---|---|---|---|---|
| Description | Telecom Circuit, PDIP8, | Telecom Circuit, CDIP8, | Telecom Circuit, PDSO8, | Telecom Circuit, PDIP8, | Telecom Circuit, CDIP8, | Telecom Circuit, PDSO8, | Telecom Circuit, PDIP8, | Telecom Circuit, CDIP8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | R-PDIP-T8 | R-XDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-XDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-XDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| Minimum operating temperature | - | -55 °C | - | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | SOP | DIP | DIP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | YES | NO | NO |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | - | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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