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SA5212D8

Description
Telecom Circuit, PDSO8,
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,19 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

SA5212D8 Overview

Telecom Circuit, PDSO8,

SA5212D8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSOP, SOP8,.25
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G8
JESD-609 codee0
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

SA5212D8 Related Products

SA5212D8 5212/BPA NE5212AD-T NE5212N SA5212N SE5212FE SE5212N SA5212FE
Description Telecom Circuit, PDSO8, Telecom Circuit, CDIP8, Telecom Circuit, PDSO8, Telecom Circuit, PDIP8, Telecom Circuit, PDIP8, Telecom Circuit, CDIP8, Telecom Circuit, PDIP8, Telecom Circuit, CDIP8,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction SOP, SOP8,.25 DIP, DIP8,.3 SOP, SOP8,.25 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
JESD-30 code R-PDSO-G8 R-XDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-XDIP-T8 R-PDIP-T8 R-XDIP-T8
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Number of terminals 8 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 125 °C 70 °C 70 °C 85 °C 125 °C 125 °C 85 °C
Minimum operating temperature -40 °C -55 °C - - -40 °C -55 °C -55 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code SOP DIP SOP DIP DIP DIP DIP DIP
Encapsulate equivalent code SOP8,.25 DIP8,.3 SOP8,.25 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES NO NO NO NO NO
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
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