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SE5212N

Description
Telecom Circuit, PDIP8,
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,19 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

SE5212N Overview

Telecom Circuit, PDIP8,

SE5212N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T8
JESD-609 codee0
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountNO
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SE5212N Related Products

SE5212N 5212/BPA NE5212AD-T NE5212N SA5212N SE5212FE SA5212D8 SA5212FE
Description Telecom Circuit, PDIP8, Telecom Circuit, CDIP8, Telecom Circuit, PDSO8, Telecom Circuit, PDIP8, Telecom Circuit, PDIP8, Telecom Circuit, CDIP8, Telecom Circuit, PDSO8, Telecom Circuit, CDIP8,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP8,.3 DIP, DIP8,.3 SOP, SOP8,.25 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 SOP, SOP8,.25 DIP, DIP8,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
JESD-30 code R-PDIP-T8 R-XDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-XDIP-T8 R-PDSO-G8 R-XDIP-T8
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Number of terminals 8 8 8 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 70 °C 70 °C 85 °C 125 °C 85 °C 85 °C
Minimum operating temperature -55 °C -55 °C - - -40 °C -55 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP SOP DIP DIP DIP SOP DIP
Encapsulate equivalent code DIP8,.3 DIP8,.3 SOP8,.25 DIP8,.3 DIP8,.3 DIP8,.3 SOP8,.25 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES NO NO NO YES NO
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level MILITARY MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
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