AM26LS32BIN datasheet, PDF - EEWORLD Datasheet

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AM26LS32BIN: DescriptionLine Driver/Receiver, TTL, PDIP16,; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size216KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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AM26LS32BIN Overview

Line Driver/Receiver, TTL, PDIP16,

AM26LS32BIN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Maximum output low current	0.024 A
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum receive delay	26 ns
Maximum slew rate	70 mA
Nominal supply voltage	5 V
surface mount	NO
technology	TTL
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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AM26LS32BIN Related Products

	AM26LS32BIN	AM26LS32BMN	AM26LS32BCN	AM26LS32BCD	AM26LS32BID
Description	Line Driver/Receiver, TTL, PDIP16,	Line Driver/Receiver, TTL, PDIP16,	Line Driver/Receiver, TTL, PDIP16,	Line Driver/Receiver, TTL, PDSO16,	Line Driver/Receiver, TTL, PDSO16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16
Maximum operating temperature	85 °C	125 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-	-	-40 °C
Maximum output low current	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum receive delay	26 ns	26 ns	26 ns	26 ns	26 ns
Maximum slew rate	70 mA	70 mA	70 mA	70 mA	70 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	INDUSTRIAL	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1

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