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MCM69L818AZP10.5R

Description
256KX18 CACHE SRAM, 10.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
Categorystorage    storage   
File Size763KB,19 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM69L818AZP10.5R Overview

256KX18 CACHE SRAM, 10.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119

MCM69L818AZP10.5R Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Base Number Matches1

MCM69L818AZP10.5R Related Products

MCM69L818AZP10.5R MCM69L736AZP7.5R MCM69L736AZP7.5 MCM69L736AZP10.5 MCM69L736AZP10.5R
Description 256KX18 CACHE SRAM, 10.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 128KX36 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 128KX36 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 128KX36 CACHE SRAM, 10.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 128KX36 CACHE SRAM, 10.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
Parts packaging code BGA BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA, BGA,
Contacts 119 119 119 119 119
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Base Number Matches 1 1 1 1 1
Maximum access time - - 7.5 ns 10.5 ns 10.5 ns
JESD-30 code - - R-PBGA-B119 R-PBGA-B119 R-PBGA-B119
length - - 22 mm 22 mm 22 mm
memory density - - 4718592 bit 4718592 bit 4718592 bit
Memory IC Type - - CACHE SRAM CACHE SRAM CACHE SRAM
memory width - - 36 36 36
Number of functions - - 1 1 1
Number of ports - - 1 1 1
Number of terminals - - 119 119 119
word count - - 131072 words 131072 words 131072 words
character code - - 128000 128000 128000
Operating mode - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - - 70 °C 70 °C 70 °C
organize - - 128KX36 128KX36 128KX36
Output characteristics - - 3-STATE 3-STATE 3-STATE
Exportable - - YES YES YES
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - BGA BGA BGA
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial - - PARALLEL PARALLEL PARALLEL
Certification status - - Not Qualified Not Qualified Not Qualified
Maximum seat height - - 2.4 mm 2.4 mm 2.4 mm
Maximum supply voltage (Vsup) - - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - - 3.15 V 3.15 V 3.15 V
Nominal supply voltage (Vsup) - - 3.3 V 3.3 V 3.3 V
surface mount - - YES YES YES
technology - - BICMOS BICMOS BICMOS
Temperature level - - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form - - BALL BALL BALL
Terminal pitch - - 1.27 mm 1.27 mm 1.27 mm
Terminal location - - BOTTOM BOTTOM BOTTOM
width - - 14 mm 14 mm 14 mm
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