MR80C31-1 datasheet, PDF - EEWORLD Datasheet

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MR80C31-1: DescriptionMicrocontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，20 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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MR80C31-1 Overview

Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,

MR80C31-1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	S-XQCC-N44
JESD-609 code	e0
Number of terminals	44
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC44,.65SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	0
speed	16 MHz
Maximum slew rate	25.9 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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MR80C31-1 Related Products

	MR80C31-1	MR80C31-1/B	MD80C31	MJ80C31-1/B	MJ80C31-1	MJ80C31
Description	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40,	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44,	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CQCC44,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051	8051
JESD-30 code	S-XQCC-N44	S-XQCC-N44	R-XDIP-T40	S-XQCC-J44	S-XQCC-J44	S-XQCC-J44
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	44	44	40	44	44	44
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	QCCN	DIP	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LCC44,.65SQ	LCC44,.65SQ	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	128	128	128	128	128	128
speed	16 MHz	16 MHz	12 MHz	16 MHz	16 MHz	12 MHz
Maximum slew rate	25.9 mA	25.9 mA	20 mA	25.9 mA	25.9 mA	20 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	DUAL	QUAD	QUAD	QUAD

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