CD40105BD datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> CD40105BD

CD40105BD: DescriptionFIFO, 16X4, Asynchronous, CMOS, CDIP16,; Categorystorage storage; File Size409KB，5 Pages; ManufacturerRCA

Download Datasheet Parametric Compare View All

CD40105BD Overview

FIFO, 16X4, Asynchronous, CMOS, CDIP16,

CD40105BD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	4
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

Preview

Download Datasheet

View All

CD40105BD Related Products

	CD40105BD	CD40105BF	CD40105BF/3A	CD40105BD/3W	CD40105BK/3	CD40105BH	CD40105BEX98	CD40105BEX	CD40105BD/3	CD40105BFX
Description	FIFO, 16X4, Asynchronous, CMOS, CDIP16,	FIFO, 16X4, Asynchronous, CMOS, CDIP16,	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDFP16	FIFO, 16X4, Asynchronous, CMOS,	FIFO, 16X4, Asynchronous, CMOS, PDIP16,	FIFO, 16X4, Asynchronous, CMOS, PDIP16,	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDIP16,
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	, DIE OR CHIP	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4	4	4	4	4	4	4
word count	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	DIE OR CHIP	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	-	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	-	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	-	16	16	16	16
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	-	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DFP	-	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	-
surface mount	NO	NO	NO	NO	YES	-	NO	NO	NO	NO
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	-	-	-	-
Maker	-	RCA	-	-	RCA	-	RCA	RCA	RCA	RCA

Recommended Resources

Photoresistor can form a bridge photodetector circuit diagram

TV preamplifier circuit

Sawtooth wave proportional control circuit

Thermocouple conversion circuit

Constant voltage converter circuit diagram

Synchronous pulse width modulation circuit

Some understanding of SD card clock line in debugging (hardware): In the past two days, I have done a low-level hardware test on the SD card on a 2410 board. The data reading and writing of the SD card often have errors, and the error location is very fixed. Later, ...; feifei985421 Embedded System

Will startio and dpcforisr disrupt each other's execution?: Will startio and dpcforisr disrupt each other's execution? During debugging, I found that dpcforisr disrupted startio....; ljytl1981 Embedded System

The Optimization and Design of PLC Control System: This article reviews the simple process of PLC controlesystem`s design, and have an analiese for the keys of PLC controle system`s design,and have some reasonable suggestion for these....; frozenviolet Industrial Control Electronics

Is there any sensor that can detect whether there is someone in front through the tinted glass?: RT, I'm curious about the black glass face recognition attendance machines. What kind of sensors do they use to determine if there is someone in front of them? If the camera is turned on all day for f...; z45217 Analog electronics

RFID price issue: Dear netizens: I saw on the Internet that a company in North America has developed a one-cent RFID tag. This will be a great boost to the popularization of RFID. Although it cannot be applied on a lar...; tmily RF/Wirelessly

What is the difference between programs developed for external ROM and built-in ROM?: The same program can run in external ROM, but it can't run in built-in ROM mode. I removed the os and only used the main function and interrupt function, and it can run, but it crashes when the os is ...; wenqiang Embedded System

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components