CD40105BH datasheet, PDF - EEWORLD Datasheet

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CD40105BH: DescriptionFIFO, 16X4, Asynchronous, CMOS,; Categorystorage storage; File Size409KB，5 Pages; ManufacturerRCA

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CD40105BH Overview

FIFO, 16X4, Asynchronous, CMOS,

CD40105BH Parametric

Parameter Name	Attribute value
package instruction	, DIE OR CHIP
Reach Compliance Code	unknown
Memory IC Type	OTHER FIFO
memory width	4
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Encapsulate equivalent code	DIE OR CHIP
power supply	5/15 V
Certification status	Not Qualified
technology	CMOS
Temperature level	MILITARY
Base Number Matches	1

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	CD40105BH	CD40105BF	CD40105BF/3A	CD40105BD/3W	CD40105BK/3	CD40105BD	CD40105BEX98	CD40105BEX	CD40105BD/3	CD40105BFX
Description	FIFO, 16X4, Asynchronous, CMOS,	FIFO, 16X4, Asynchronous, CMOS, CDIP16,	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDFP16	FIFO, 16X4, Asynchronous, CMOS, CDIP16,	FIFO, 16X4, Asynchronous, CMOS, PDIP16,	FIFO, 16X4, Asynchronous, CMOS, PDIP16,	FIFO, 16X4, Asynchronous, CMOS, CDIP16	FIFO, 16X4, Asynchronous, CMOS, CDIP16,
package instruction	, DIE OR CHIP	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4	4	4	4	4	4	4
word count	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4
Encapsulate equivalent code	DIE OR CHIP	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	-
Base Number Matches	1	1	1	1	1	1	-	-	-	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	RCA	-	-	RCA	-	RCA	RCA	RCA	RCA
JESD-30 code	-	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	-	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	-	16	16	16	16	16	16	16	16	16
Package body material	-	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	-	DIP	DIP	DIP	DFP	DIP	DIP	DIP	DIP	DIP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	-	NO	NO	NO	YES	NO	NO	NO	NO	NO
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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