CY7C266-25PC datasheet, PDF - EEWORLD Datasheet

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CY7C266-25PC: DescriptionOTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size296KB，9 Pages; ManufacturerCypress Semiconductor

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CY7C266-25PC Overview

OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

CY7C266-25PC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	25 ns
Other features	POWER SWITCHED PROM
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	37.211 mm
memory density	65536 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.015 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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CY7C266-25PC Related Products

	CY7C266-25PC	CY7C266-25LMB	CY7C266-45WC	CY7C266-45DMB	CY7C266-25WC
Description	OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 8KX8, 25ns, CMOS, CQCC32, LCC-32	UVPROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	OTP ROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28	UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
Parts packaging code	DIP	QFJ	DIP	DIP	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28	QCCN, LCC32,.45X.55	0.600 INCH, WINDOWED, CERDIP-28	0.600 INCH, CERDIP-28	0.600 INCH, WINDOWED, CERDIP-28
Contacts	28	32	28	28	28
Reach Compliance Code	not_compliant	compliant	not_compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	25 ns	25 ns	45 ns	45 ns	25 ns
Other features	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
length	37.211 mm	13.97 mm	37.338 mm	37.338 mm	37.338 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	OTP ROM	OTP ROM	UVPROM	OTP ROM	UVPROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	28	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	WDIP	DIP	WDIP
Encapsulate equivalent code	DIP28,.6	LCC32,.45X.55	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE, WINDOW	IN-LINE	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Programming voltage	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.286 mm	5.715 mm	5.715 mm	5.715 mm
Maximum standby current	0.015 A	0.015 A	0.015 A	0.015 A	0.015 A
Maximum slew rate	0.12 mA	0.14 mA	0.1 mA	0.12 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL
width	15.24 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible
JESD-609 code	e0	-	e0	e0	e0
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	-	-

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