UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | 0.600 INCH, WINDOWED, CERDIP-28 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | POWER SWITCHED PROM |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| length | 37.338 mm |
| memory density | 65536 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.715 mm |
| Maximum standby current | 0.015 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| CY7C266-25WC | CY7C266-25PC | CY7C266-25LMB | CY7C266-45WC | CY7C266-45DMB | |
|---|---|---|---|---|---|
| Description | UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | OTP ROM, 8KX8, 25ns, CMOS, CQCC32, LCC-32 | UVPROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 |
| Parts packaging code | DIP | DIP | QFJ | DIP | DIP |
| package instruction | 0.600 INCH, WINDOWED, CERDIP-28 | 0.600 INCH, PLASTIC, DIP-28 | QCCN, LCC32,.45X.55 | 0.600 INCH, WINDOWED, CERDIP-28 | 0.600 INCH, CERDIP-28 |
| Contacts | 28 | 28 | 32 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | not_compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 25 ns | 25 ns | 45 ns | 45 ns |
| Other features | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T28 | R-PDIP-T28 | R-CQCC-N32 | R-GDIP-T28 | R-GDIP-T28 |
| length | 37.338 mm | 37.211 mm | 13.97 mm | 37.338 mm | 37.338 mm |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 32 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | DIP | QCCN | WDIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.715 mm | 5.08 mm | 2.286 mm | 5.715 mm | 5.715 mm |
| Maximum standby current | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.14 mA | 0.1 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
| JESD-609 code | e0 | e0 | - | e0 | e0 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN LEAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | - | 1 | 1 | 1 | - |
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