OTP ROM, 8KX8, 25ns, CMOS, CQCC32, LCC-32
| Parameter Name | Attribute value |
| Parts packaging code | QFJ |
| package instruction | QCCN, LCC32,.45X.55 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | POWER SWITCHED PROM |
| I/O type | COMMON |
| JESD-30 code | R-CQCC-N32 |
| length | 13.97 mm |
| memory density | 65536 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 2.286 mm |
| Maximum standby current | 0.015 A |
| Maximum slew rate | 0.14 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 11.43 mm |
| Base Number Matches | 1 |
| CY7C266-25LMB | CY7C266-25PC | CY7C266-45WC | CY7C266-45DMB | CY7C266-25WC | |
|---|---|---|---|---|---|
| Description | OTP ROM, 8KX8, 25ns, CMOS, CQCC32, LCC-32 | OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | UVPROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 |
| Parts packaging code | QFJ | DIP | DIP | DIP | DIP |
| package instruction | QCCN, LCC32,.45X.55 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, WINDOWED, CERDIP-28 | 0.600 INCH, CERDIP-28 | 0.600 INCH, WINDOWED, CERDIP-28 |
| Contacts | 32 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 25 ns | 45 ns | 45 ns | 25 ns |
| Other features | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-CQCC-N32 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| length | 13.97 mm | 37.211 mm | 37.338 mm | 37.338 mm | 37.338 mm |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | OTP ROM | OTP ROM | UVPROM | OTP ROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | DIP | WDIP | DIP | WDIP |
| Encapsulate equivalent code | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 5.08 mm | 5.715 mm | 5.715 mm | 5.715 mm |
| Maximum standby current | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
| Maximum slew rate | 0.14 mA | 0.12 mA | 0.1 mA | 0.12 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL |
| width | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | - | - |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
| JESD-609 code | - | e0 | e0 | e0 | e0 |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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