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24VL014H/P

Description
1K I2C⑩ Serial EEPROM with Half-Array Write-Protect
Categorystorage    storage   
File Size448KB,28 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric Compare View All

24VL014H/P Overview

1K I2C⑩ Serial EEPROM with Half-Array Write-Protect

24VL014H/P Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeDIP
package instruction0.300 INCH, LEAD FREE, PLASTIC, DIP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time8 weeks
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDIP-T8
JESD-609 codee3
length9.271 mm
memory density1024 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT APPLICABLE
power supply1.8/3,3 V
Certification statusNot Qualified
Maximum seat height5.334 mm
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.5 V
Nominal supply voltage (Vsup)1.8 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT APPLICABLE
width7.62 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
24VL014H
1K I
2
C
Serial EEPROM with Half-Array Write-Protect
Device Selection Table
Part Number
24VL014H
V
CC
Range
1.5 to 3.6V
Max Clock
400 kHz
(1)
Description:
The Microchip Technology Inc. 24VL014H is a 1 Kbit
Serial Electrically Erasable PROM with operation
down to 1.5V. The device is organized as a single block
of 128 x 8-bit memory with a 2-wire serial interface.
Low-current design permits operation with maximum
standby and active currents of only 1
μA
and 400
μA,
respectively. The device has a page write capability for
up to 16 bytes of data. Functional address lines allow
the connection of up to eight 24VL014H devices on the
same bus for up to 8 Kbits of contiguous EEPROM
memory. The device is available in the standard 8-pin
PDIP, 8-pin SOIC (150 mil), TSSOP, 2x3 TDFN and
MSOP packages.
Note 1:
100 kHz for V
CC
< 1.8V
Features:
• Single-Supply with Operation Down to 1.5V
• Low-Power CMOS Technology:
- 400
μA
active current, maximum
- 1
μA
standby current, maximum
• 2-Wire Serial Interface Bus, I
2
C™ Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Compatibility
• Page Write Buffer for up to 16 Bytes
• Self-Timed Write Cycle (including Auto-Erase)
• Hardware Write Protection for Half Array
(40h-7Fh)
• Cascadable up to Eight Devices
• More than 1 Million Erase/Write Cycles
• ESD Protection > 4,000V
• Data Retention > 200 Years
• Factory Programming (QTP) Available
• 8-pin PDIP, SOIC, TSSOP, TDFN and MSOP
Packages
• Temperature Range:
- -20°C to +85°C
• Pb-Free and RoHS Compliant
Block Diagram
A0 A1 A2
WP
HV Generator
Memory
Control
Logic
I/O
Control
Logic
XDEC
EEPROM
Array
SDA SCL
V
CC
V
SS
Write-Protect
Circuitry
YDEC
Sense Amp.
R/W Control
Package Types
PDIP, MSOP
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
WP
SCL
A0
A1
A2
SOIC, TSSOP
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
SDA V
SS
TDFN
A0 1
A1 2
A2 3
V
SS
4
8 V
CC
7 WP
6 SCL
5 SDA
©
2008 Microchip Technology Inc.
DS22116A-page 1

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Is it Rohs certified? conform to conform to conform to - conform to - - conform to conform to
Parts packaging code DIP SOIC MSOP DIP SOIC - - DFN MSOP
package instruction 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 4.40 MM, PLASTIC, TSSOP-8 PLASTIC, MSOP-8 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 4.40 MM, PLASTIC, TSSOP-8 - - 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 PLASTIC, MSOP-8
Contacts 8 8 8 8 8 - - 8 8
Reach Compliance Code compli compli compli compli compli - - compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - - EAR99 EAR99
Factory Lead Time 8 weeks 9 weeks 5 weeks - 9 weeks - - - 5 weeks
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz - - 0.4 MHz 0.4 MHz
Data retention time - minimum 200 200 200 - 200 - - 200 200
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR - 1010DDDR - - 1010DDDR 1010DDDR
JESD-30 code R-PDIP-T8 R-PDSO-G8 S-PDSO-G8 R-PDIP-T8 R-PDSO-G8 - - R-PDSO-N8 S-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 - - e4 e3
length 9.271 mm 4.4 mm 3 mm 9.271 mm 4.4 mm - - 3 mm 3 mm
memory density 1024 bi 1024 bi 1024 bi 1024 bi 1024 bi - - 1024 bi 1024 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM - - EEPROM EEPROM
memory width 8 8 8 8 8 - - 8 8
Number of functions 1 1 1 1 1 - - 1 1
Number of terminals 8 8 8 8 8 - - 8 8
word count 128 words 128 words 128 words 128 words 128 words - - 128 words 128 words
character code 128 128 128 128 128 - - 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C - - 85 °C 85 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C - - -20 °C -20 °C
organize 128X8 128X8 128X8 128X8 128X8 - - 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSOP1 TSSOP DIP TSOP1 - - VSON TSSOP
Encapsulate equivalent code DIP8,.3 TSSOP8,.25 TSSOP8,.19 - TSSOP8,.25 - - SOLCC8,.11,20 TSSOP8,.19
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR - - RECTANGULAR SQUARE
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE - - SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL - - SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT APPLICABLE 260 260 - 260 - - - 260
power supply 1.8/3,3 V 1.8/3,3 V 1.8/3,3 V - 1.8/3,3 V - - 1.8/3,3 V 1.8/3,3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified Not Qualified
Maximum seat height 5.334 mm 1.2 mm 1.1 mm 5.334 mm 1.2 mm - - 0.8 mm 1.1 mm
Serial bus type I2C I2C I2C I2C I2C - - I2C I2C
Maximum standby current 0.000001 A 0.000001 A 0.000001 A - 0.000001 A - - 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA - 0.003 mA - - 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V - - 1.5 V 1.5 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V - - 1.8 V 1.8 V
surface mount NO YES YES NO YES - - YES YES
technology CMOS CMOS CMOS CMOS CMOS - - CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER - - OTHER OTHER
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed - - NICKEL PALLADIUM GOLD Matte Tin (Sn) - annealed
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING - - NO LEAD GULL WING
Terminal pitch 2.54 mm 0.65 mm 0.65 mm 2.54 mm 0.65 mm - - 0.5 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL - - DUAL DUAL
Maximum time at peak reflow temperature NOT APPLICABLE 40 40 - 40 - - - 40
width 7.62 mm 3 mm 3 mm 7.62 mm 3 mm - - 2 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms - - 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE - HARDWARE - - HARDWARE HARDWARE
Base Number Matches 1 1 1 1 1 - - 1 1

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