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24VL014H/ST

Description
1K I2C⑩ Serial EEPROM with Half-Array Write-Protect
Categorystorage    storage   
File Size448KB,28 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric Compare View All

24VL014H/ST Overview

1K I2C⑩ Serial EEPROM with Half-Array Write-Protect

24VL014H/ST Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instruction4.40 MM, PLASTIC, TSSOP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time9 weeks
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density1024 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply1.8/3,3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.5 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
24VL014H
1K I
2
C
Serial EEPROM with Half-Array Write-Protect
Device Selection Table
Part Number
24VL014H
V
CC
Range
1.5 to 3.6V
Max Clock
400 kHz
(1)
Description:
The Microchip Technology Inc. 24VL014H is a 1 Kbit
Serial Electrically Erasable PROM with operation
down to 1.5V. The device is organized as a single block
of 128 x 8-bit memory with a 2-wire serial interface.
Low-current design permits operation with maximum
standby and active currents of only 1
μA
and 400
μA,
respectively. The device has a page write capability for
up to 16 bytes of data. Functional address lines allow
the connection of up to eight 24VL014H devices on the
same bus for up to 8 Kbits of contiguous EEPROM
memory. The device is available in the standard 8-pin
PDIP, 8-pin SOIC (150 mil), TSSOP, 2x3 TDFN and
MSOP packages.
Note 1:
100 kHz for V
CC
< 1.8V
Features:
• Single-Supply with Operation Down to 1.5V
• Low-Power CMOS Technology:
- 400
μA
active current, maximum
- 1
μA
standby current, maximum
• 2-Wire Serial Interface Bus, I
2
C™ Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Compatibility
• Page Write Buffer for up to 16 Bytes
• Self-Timed Write Cycle (including Auto-Erase)
• Hardware Write Protection for Half Array
(40h-7Fh)
• Cascadable up to Eight Devices
• More than 1 Million Erase/Write Cycles
• ESD Protection > 4,000V
• Data Retention > 200 Years
• Factory Programming (QTP) Available
• 8-pin PDIP, SOIC, TSSOP, TDFN and MSOP
Packages
• Temperature Range:
- -20°C to +85°C
• Pb-Free and RoHS Compliant
Block Diagram
A0 A1 A2
WP
HV Generator
Memory
Control
Logic
I/O
Control
Logic
XDEC
EEPROM
Array
SDA SCL
V
CC
V
SS
Write-Protect
Circuitry
YDEC
Sense Amp.
R/W Control
Package Types
PDIP, MSOP
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
WP
SCL
A0
A1
A2
SOIC, TSSOP
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
SDA V
SS
TDFN
A0 1
A1 2
A2 3
V
SS
4
8 V
CC
7 WP
6 SCL
5 SDA
©
2008 Microchip Technology Inc.
DS22116A-page 1

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Is it Rohs certified? conform to conform to conform to - conform to - - conform to conform to
Parts packaging code SOIC SOIC MSOP DIP DIP - - DFN MSOP
package instruction 4.40 MM, PLASTIC, TSSOP-8 4.40 MM, PLASTIC, TSSOP-8 PLASTIC, MSOP-8 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 - - 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 PLASTIC, MSOP-8
Contacts 8 8 8 8 8 - - 8 8
Reach Compliance Code compli compli compli compli compli - - compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - - EAR99 EAR99
Factory Lead Time 9 weeks 9 weeks 5 weeks - 8 weeks - - - 5 weeks
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz - - 0.4 MHz 0.4 MHz
Data retention time - minimum 200 200 200 - 200 - - 200 200
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR - 1010DDDR - - 1010DDDR 1010DDDR
JESD-30 code R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDIP-T8 R-PDIP-T8 - - R-PDSO-N8 S-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 - - e4 e3
length 4.4 mm 4.4 mm 3 mm 9.271 mm 9.271 mm - - 3 mm 3 mm
memory density 1024 bi 1024 bi 1024 bi 1024 bi 1024 bi - - 1024 bi 1024 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM - - EEPROM EEPROM
memory width 8 8 8 8 8 - - 8 8
Number of functions 1 1 1 1 1 - - 1 1
Number of terminals 8 8 8 8 8 - - 8 8
word count 128 words 128 words 128 words 128 words 128 words - - 128 words 128 words
character code 128 128 128 128 128 - - 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C - - 85 °C 85 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C - - -20 °C -20 °C
organize 128X8 128X8 128X8 128X8 128X8 - - 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 TSSOP DIP DIP - - VSON TSSOP
Encapsulate equivalent code TSSOP8,.25 TSSOP8,.25 TSSOP8,.19 - DIP8,.3 - - SOLCC8,.11,20 TSSOP8,.19
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR - - RECTANGULAR SQUARE
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE - - SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL - - SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 - NOT APPLICABLE - - - 260
power supply 1.8/3,3 V 1.8/3,3 V 1.8/3,3 V - 1.8/3,3 V - - 1.8/3,3 V 1.8/3,3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.1 mm 5.334 mm 5.334 mm - - 0.8 mm 1.1 mm
Serial bus type I2C I2C I2C I2C I2C - - I2C I2C
Maximum standby current 0.000001 A 0.000001 A 0.000001 A - 0.000001 A - - 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA - 0.003 mA - - 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V - - 1.5 V 1.5 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V - - 1.8 V 1.8 V
surface mount YES YES YES NO NO - - YES YES
technology CMOS CMOS CMOS CMOS CMOS - - CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER - - OTHER OTHER
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed - - NICKEL PALLADIUM GOLD Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE - - NO LEAD GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 2.54 mm 2.54 mm - - 0.5 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL - - DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 - NOT APPLICABLE - - - 40
width 3 mm 3 mm 3 mm 7.62 mm 7.62 mm - - 2 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms - - 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE - HARDWARE - - HARDWARE HARDWARE
Base Number Matches 1 1 1 1 1 - - 1 1

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