CD4002UBH datasheet, PDF - EEWORLD Datasheet

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CD4002UBH: DescriptionIC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIE; Categorylogic logic; File Size825KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4002UBH Overview

IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIE

CD4002UBH Parametric

Parameter Name	Attribute value
package instruction	, DIE OR CHIP
Reach Compliance Code	compliant
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Encapsulate equivalent code	DIE OR CHIP
power supply	5/15 V
Prop。Delay @ Nom-Sup	120 ns
Certification status	Not Qualified
Schmitt trigger	NO
technology	CMOS
Temperature level	MILITARY
Base Number Matches	1

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Description	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIE	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 3-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 3-INPUT NOR,CMOS,FP,14PIN,CERAMIC	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,DIE	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,FP,14PIN,CERAMIC
Reach Compliance Code	compliant	not_compliant	not_compliant	not_compliant	not_compliant	compliant	not_compliant	compliant	compliant
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C	125 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C
Encapsulate equivalent code	DIE OR CHIP	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	FL14,.3	DIP14,.3	DIE OR CHIP	FL14,.3
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Prop。Delay @ Nom-Sup	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY
package instruction	, DIE OR CHIP	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	-	DFP, FL14,.3	DIP, DIP14,.3	, DIE OR CHIP	DFP, FL14,.3
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	-	-	NOR GATE	NOR GATE	NOR GATE
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	-	incompatible	-	-
JESD-30 code	-	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDFP-F14	R-PDIP-T14	-	R-XDFP-F14
JESD-609 code	-	e0	e0	e0	e0	-	e0	-	-
Number of terminals	-	14	14	14	14	14	14	-	14
Package body material	-	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	-	CERAMIC
encapsulated code	-	DIP	DIP	DIP	DIP	DFP	DIP	-	DFP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	-	FLATPACK
surface mount	-	NO	NO	NO	NO	YES	NO	-	YES
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	-
Terminal form	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	-	FLAT
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	-	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maker	-	-	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

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