CD4002UBD datasheet, PDF - EEWORLD Datasheet

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CD4002UBD: DescriptionIC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC; Categorylogic logic; File Size825KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4002UBD Overview

IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC

CD4002UBD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
Factory Lead Time	1 week
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Prop。Delay @ Nom-Sup	120 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NOR,CMOS,DIE	IC,LOGIC GATE,DUAL 3-INPUT NOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 3-INPUT NOR,CMOS,FP,14PIN,CERAMIC	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,DIE	IC,LOGIC GATE,3 3-INPUT NOR,CMOS,FP,14PIN,CERAMIC
Reach Compliance Code	not_compliant	not_compliant	not_compliant	compliant	not_compliant	compliant	not_compliant	compliant	compliant
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Maximum operating temperature	125 °C	85 °C	125 °C	125 °C	125 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIE OR CHIP	DIP14,.3	FL14,.3	DIP14,.3	DIE OR CHIP	FL14,.3
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Prop。Delay @ Nom-Sup	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	-	incompatible	-	-
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	, DIE OR CHIP	-	DFP, FL14,.3	DIP, DIP14,.3	, DIE OR CHIP	DFP, FL14,.3
JESD-30 code	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	-	R-XDIP-T14	R-XDFP-F14	R-PDIP-T14	-	R-XDFP-F14
JESD-609 code	e0	e0	e0	-	e0	-	e0	-	-
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	-	-	NOR GATE	NOR GATE	NOR GATE
Number of terminals	14	14	14	-	14	14	14	-	14
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	-	CERAMIC	CERAMIC	PLASTIC/EPOXY	-	CERAMIC
encapsulated code	DIP	DIP	DIP	-	DIP	DFP	DIP	-	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	-	IN-LINE	FLATPACK	IN-LINE	-	FLATPACK
surface mount	NO	NO	NO	-	NO	YES	NO	-	YES
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	FLAT	THROUGH-HOLE	-	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	1.27 mm	2.54 mm	-	1.27 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	-	DUAL
Maker	-	-	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

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