Telecom Circuit, Bipolar, PDIP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 100088711 |
| package instruction | DIP-14 |
| Reach Compliance Code | unknown |
| YTEOL | 0 |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum slew rate | 11 mA |
| Nominal supply voltage | 12 V |
| surface mount | NO |
| technology | BIPOLAR |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| XR2211CP | RC2211AM | RC2211AN | RV2211AN | XR2211M | XR2211P | |
|---|---|---|---|---|---|---|
| Description | Telecom Circuit, Bipolar, PDIP14, | Modem-Demodulator, Bipolar, PDSO14, PLASTIC, SOIC-14 | Telecom Circuit, 1-Func, Bipolar, PDIP14, PLASTIC, DIP-14 | Telecom Circuit, 1-Func, Bipolar, PDIP14, PLASTIC, DIP-14 | Telecom Circuit, Bipolar, CDIP14, | Telecom Circuit, Bipolar, PDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Objectid | 100088711 | 1438359196 | 1438359190 | 1438359193 | 100088704 | 100088721 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 125 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | SOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| surface mount | NO | YES | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Telecom integrated circuit types | TELECOM CIRCUIT | MODEM-DEMODULATOR | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| package instruction | DIP-14 | PLASTIC, SOIC-14 | PLASTIC, DIP-14 | PLASTIC, DIP-14 | - | - |
| Maximum slew rate | 11 mA | 0.011 mA | 0.011 mA | 0.011 mA | 9 mA | - |
| power supply | - | 12 V | 12 V | 12 V | 12 V | 12 V |
京公网安备 11010802033920号
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