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MC9S08RE32CFDE

Description
8-BIT, FLASH, 8MHz, MICROCONTROLLER, QCC48, 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,236 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MC9S08RE32CFDE Overview

8-BIT, FLASH, 8MHz, MICROCONTROLLER, QCC48, 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48

MC9S08RE32CFDE Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeQFN
package instructionHVQCCN,
Contacts48
Reach Compliance Codeunknown
Has ADCNO
Address bus width
bit size8
maximum clock frequency16 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-XQCC-N48
length7 mm
Number of I/O lines39
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification statusNot Qualified
ROM programmabilityFLASH
Maximum seat height1 mm
speed8 MHz
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1
Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
Addendum for New QFN
Package Migration
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806:
Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
© Freescale Semiconductor, Inc., 2014. All rights reserved.
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