Cache SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68
| Parameter Name | Attribute value |
| Maker | Cobham Semiconductor Solutions |
| Parts packaging code | QFP |
| package instruction | QFF, |
| Contacts | 68 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 25 ns |
| Other features | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 |
| JESD-30 code | S-CQFP-F68 |
| JESD-609 code | e4 |
| memory density | 16777216 bit |
| Memory IC Type | CACHE SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QFF |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 3.556 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 5962-9562408HYC | 5962-9562407HYC | 5962-9562405HYX | 5962-9562405HYC | 5962-9562409HYC | 5962-9562410HXX | 5962-9562406HYC | 5962-9562408HYX | 5962-9562406HYX | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Cache SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 35ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 55ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 55ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 20ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 17ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 45ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Cache SRAM Module, 2MX8, 45ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, CERAMIC, QFP-68 |
| Maker | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| package instruction | QFF, | QFF, | QFF, | QFF, | QFF, | QFF, | QFF, | QFF, | QFF, |
| Contacts | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 25 ns | 35 ns | 55 ns | 55 ns | 20 ns | 17 ns | 45 ns | 25 ns | 45 ns |
| Other features | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 | USER CONFIGURABLE AS 512K X 32 OR 1M X 16 |
| JESD-30 code | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QFF | QFF | QFF | QFF | QFF | QFF | QFF | QFF | QFF |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| JESD-609 code | e4 | e4 | - | e4 | e4 | - | e4 | - | - |
| Terminal surface | GOLD | GOLD | - | GOLD | GOLD | - | GOLD | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |