JM54AC174SFA-FH
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 65000000 Hz |
| MaximumI(ol) | 0.012 A |
| Humidity sensitivity level | 1 |
| Number of functions | 6 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 14 ns |
| Certification status | Not Qualified |
| Filter level | 38535V;38534K;883S |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 300k Rad(Si) V |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| JM54AC174SFA-FH | 54ACT174LMQB | 54ACT174FMQB | 54AC174FMQB | 54AC174DMQB | 54ACT174DMQB | 54AC174LMQB | |
|---|---|---|---|---|---|---|---|
| Description | JM54AC174SFA-FH | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, DFP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, DFP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | unknow | unknow | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F16 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| MaximumI(ol) | 0.012 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.012 A |
| Number of functions | 6 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 20 | 16 | 16 | 16 | 16 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | QCCN | DFP | DFP | DIP | DIP | QCCN |
| Encapsulate equivalent code | FL16,.3 | LCC20,.35SQ | FL16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER |
| power supply | 3.3/5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535V;38534K;883S | MIL-STD-883 Class B | MIL-STD-883 Class B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B | 38535Q/M;38534H;883B |
| surface mount | YES | YES | YES | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | NO LEAD | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum Frequency@Nom-Sup | 65000000 Hz | - | - | 65000000 Hz | 65000000 Hz | 95000000 Hz | 65000000 Hz |
| series | - | ACT | ACT | AC | AC | ACT | AC |
| length | - | 8.89 mm | 9.6645 mm | 9.6645 mm | 19.43 mm | 19.43 mm | 8.89 mm |
| Number of digits | - | 6 | 6 | 6 | 6 | 6 | 6 |
| Output polarity | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| method of packing | - | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| propagation delay (tpd) | - | 13 ns | 13 ns | 14 ns | 14 ns | 13 ns | 14 ns |
| Maximum seat height | - | 1.905 mm | 2.032 mm | 2.032 mm | 5.08 mm | 5.08 mm | 1.905 mm |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 6 V | 6 V | 5.5 V | 6 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 2 V | 2 V | 4.5 V | 2 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 3.3 V | 3.3 V | 5 V | 3.3 V |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 8.89 mm | 6.604 mm | 6.604 mm | 7.62 mm | 7.62 mm | 8.89 mm |
| minfmax | - | 95 MHz | 95 MHz | 90 MHz | 90 MHz | 95 MHz | 90 MHz |
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