EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,
| Parameter Name | Attribute value |
| package instruction | DIMM, DIMM144,32 |
| Reach Compliance Code | compliant |
| Maximum access time | 60 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDMA-N144 |
| memory density | 268435456 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 64 |
| Number of terminals | 144 |
| word count | 4194304 words |
| character code | 4000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX64 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM144,32 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| self refresh | YES |
| Maximum standby current | 0.0012 A |
| Maximum slew rate | 0.56 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| M466F0404AF1-L600 | M466F0404BF2-L600 | M466F0404BF2-L500 | |
|---|---|---|---|
| Description | EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144, | EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144, | EDO DRAM Module, 4MX64, 50ns, CMOS, PDMA144, |
| package instruction | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 |
| Reach Compliance Code | compliant | compliant | compliant |
| Maximum access time | 60 ns | 60 ns | 50 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDMA-N144 | R-PDMA-N144 | R-PDMA-N144 |
| memory density | 268435456 bit | 268435456 bit | 268435456 bit |
| Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 64 | 64 | 64 |
| Number of terminals | 144 | 144 | 144 |
| word count | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 4MX64 | 4MX64 | 4MX64 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIMM | DIMM | DIMM |
| Encapsulate equivalent code | DIMM144,32 | DIMM144,32 | DIMM144,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 | 4096 |
| self refresh | YES | YES | YES |
| Maximum standby current | 0.0012 A | 0.0012 A | 0.0012 A |
| Maximum slew rate | 0.56 mA | 0.44 mA | 0.48 mA |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |