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M466F0404BF2-L600

Description
EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,
Categorystorage    storage   
File Size419KB,7 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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M466F0404BF2-L600 Overview

EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,

M466F0404BF2-L600 Parametric

Parameter NameAttribute value
MakerSAMSUNG
package instructionDIMM, DIMM144,32
Reach Compliance Codecompliant
Maximum access time60 ns
I/O typeCOMMON
JESD-30 codeR-PDMA-N144
memory density268435456 bit
Memory IC TypeEDO DRAM MODULE
memory width64
Number of terminals144
word count4194304 words
character code4000000
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.0012 A
Maximum slew rate0.44 mA
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
Base Number Matches1

M466F0404BF2-L600 Related Products

M466F0404BF2-L600 M466F0404BF2-L500 M466F0404AF1-L600
Description EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144, EDO DRAM Module, 4MX64, 50ns, CMOS, PDMA144, EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,
package instruction DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32
Reach Compliance Code compliant compliant compliant
Maximum access time 60 ns 50 ns 60 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-PDMA-N144 R-PDMA-N144 R-PDMA-N144
memory density 268435456 bit 268435456 bit 268435456 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE
memory width 64 64 64
Number of terminals 144 144 144
word count 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000
Maximum operating temperature 70 °C 70 °C 70 °C
organize 4MX64 4MX64 4MX64
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIMM DIMM DIMM
Encapsulate equivalent code DIMM144,32 DIMM144,32 DIMM144,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096
self refresh YES YES YES
Maximum standby current 0.0012 A 0.0012 A 0.0012 A
Maximum slew rate 0.44 mA 0.48 mA 0.56 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL
Base Number Matches 1 1 1
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