M466F0404BF2-L500 datasheet, PDF

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M466F0404BF2-L500: DescriptionEDO DRAM Module, 4MX64, 50ns, CMOS, PDMA144,; Categorystorage storage; File Size419KB，7 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M466F0404BF2-L500 Overview

EDO DRAM Module, 4MX64, 50ns, CMOS, PDMA144,

M466F0404BF2-L500 Parametric

Parameter Name	Attribute value
package instruction	DIMM, DIMM144,32
Reach Compliance Code	compliant
Maximum access time	50 ns
I/O type	COMMON
JESD-30 code	R-PDMA-N144
memory density	268435456 bit
Memory IC Type	EDO DRAM MODULE
memory width	64
Number of terminals	144
word count	4194304 words
character code	4000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX64
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,32
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum standby current	0.0012 A
Maximum slew rate	0.48 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	DUAL
Base Number Matches	1

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M466F0404BF2-L500 Related Products

	M466F0404BF2-L500	M466F0404BF2-L600	M466F0404AF1-L600
Description	EDO DRAM Module, 4MX64, 50ns, CMOS, PDMA144,	EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,	EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA144,
package instruction	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32
Reach Compliance Code	compliant	compliant	compliant
Maximum access time	50 ns	60 ns	60 ns
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PDMA-N144	R-PDMA-N144	R-PDMA-N144
memory density	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	64	64	64
Number of terminals	144	144	144
word count	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	4MX64	4MX64	4MX64
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM144,32	DIMM144,32	DIMM144,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096
self refresh	YES	YES	YES
Maximum standby current	0.0012 A	0.0012 A	0.0012 A
Maximum slew rate	0.48 mA	0.44 mA	0.56 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL
Base Number Matches	1	1	1

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