AU80610004671AA datasheet, PDF

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AU80610004671AA: DescriptionMicroprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，74 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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Microprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559

AU80610004671AA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	BGA,
Contacts	559
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Address bus width	33
bit size	64
boundary scan	YES
maximum clock frequency	133 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B559
length	22 mm
low power mode	YES
Number of terminals	559
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
speed	1660 MHz
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal location	BOTTOM
width	22 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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Intel® Atom™ Processor 230

Series

Datasheet

April 2010

∆

Document Number: 319977-003

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT

AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY

WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL

PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,

OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

45-nm products are manufactured on a lead-free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS

exemptions may apply to other components used in the product package. Residual amounts of halogens are below November,

2007 proposed IPC/JEDEC J-STD-709 standards.

∆

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. Click here for details

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications

enabled for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will

vary depending on your hardware and software configurations. See http://www.intel.com/technology/intel64/index.htm for more

information including details on which processors support Intel 64, or consult with your system vendor for more information.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

(VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be

compatible with all operating systems. Please check with your application vendor.

Hyper-Threading Technology requires a computer system with a processor supporting Hyper-Threading Technology and HT

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software

you see. See http://www.intel.com/technology/hypertheading/ for more information including details on which processor

supports HT Technology.

Intel, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction .....................................................................................................6

1.1

1.2

1.3

2.1

Intel® Atom™ Processor 230 Series Features .............................................6

Terminology ..........................................................................................7

Reference Documents .............................................................................8

Clock Control and Low-power States .........................................................9

2.1.1

Thread Low-power State Descriptions ......................................... 10

2.1.2

Package Low-power State Descriptions ....................................... 11

2.1.3

Front Side Bus ........................................................................ 11

FSB and GTLREF .................................................................................. 12

Power and Ground Pins ......................................................................... 12

Decoupling Guidelines ........................................................................... 12

3.3.1

VCCP Decoupling ..................................................................... 13

3.3.2

FSB AGTL+ Decoupling ............................................................ 13

Voltage Identification and Power Sequencing ............................................ 13

Catastrophic Thermal Protection ............................................................. 15

Reserved and Unused Pins ..................................................................... 15

FSB Frequency Select Signals (BSEL[2:0]) ............................................... 16

FSB Signal Groups ................................................................................ 16

CMOS Asynchronous Signals .................................................................. 17

3.10 Maximum Ratings ......................................................................... 17

Processor DC Specifications ................................................................... 18

AGTL+ FSB Specifications ...................................................................... 22

Package Mechanical Specifications .......................................................... 23

4.1.1

Package Mechanical Drawings ................................................... 23

4.1.2

Package Loading Specifications ................................................. 24

4.1.3

Processor Mass Specifications ................................................... 24

4.1.4

Processor Pinout Assignment .................................................... 24

Signal Description ................................................................................ 30

Thermal

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

Specifications .......................................................................... 38

Thermal Diode ........................................................................ 39

Intel® Thermal Monitor............................................................ 41

Digital Thermal Sensor ............................................................. 42

Out of Specification Detection ................................................... 43

PROCHOT# Signal Pin .............................................................. 43

Low Power Features ..........................................................................................9

Electrical Specifications .................................................................................... 12

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

4.1

Package Mechanical Specifications and Ball Information ........................................ 23

4.2

5.1

Thermal Specifications and Design Considerations ............................................... 38

Debug Tools Specifications ............................................................................... 45

Datasheet

Figures

Figure

1. Thread Low-power States .....................................................................9

2. Package Mechanical Drawing ................................................................ 23

3. Pinout Diagram (Top View, Left Side) ................................................... 25

4. Pinout Diagram (Top View, Right Side) ................................................. 26

Tables

Table

1. Coordination of Thread Low-power States at the Package Level ................. 10

2. Voltage Identification Definition ............................................................ 13

3. Processor VID Pin to VRD11 VID Pin Mapping .......................................... 15

4. BSEL[2:0] Encoding for BCLK Frequency ................................................ 16

5. FSB Pin Groups................................................................................... 16

6. Processor Absolute Maximum Ratings .................................................... 18

7. Voltage and Current Specifications for the Intel® Atom™ Processor ........... 19

8. FSB Differential BCLK Specifications ...................................................... 20

9. AGTL+/CMOS Signal Group DC Specifications ......................................... 20

10. Legacy CMOS Signal Group DC Specifications ........................................ 21

11. Open Drain Signal Group DC Specifications ........................................... 22

13. Pinout Arranged By Signal Name ......................................................... 27

14. Signal Description .............................................................................. 30

15. Power Specifications for the Processor .................................................. 39

16. Thermal Diode Interface ..................................................................... 40

17. Thermal Diode Parameters using Transistor Model ................................. 40

Datasheet

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Description	Microprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1800MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1660MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1830MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1800MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559	Microprocessor, 64-Bit, 1830MHz, CMOS, PBGA559, HALOGEN FREE, FC-BGA8-559
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	559	559	559	559	559	559	559	559
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	unknown
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	33	33	33	33	33	33	33	33
bit size	64	64	64	64	64	64	64	64
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz
External data bus width	64	64	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559	S-PBGA-B559
length	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	559	559	559	559	559	559	559	559
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
speed	1660 MHz	1660 MHz	1660 MHz	1800 MHz	1660 MHz	1830 MHz	1800 MHz	1830 MHz
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Maker	-	-	-	Intel	Intel	Intel	Intel	Intel

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