AM100469FC datasheet, PDF - EEWORLD Datasheet

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AM100469FC: DescriptionCache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24; Categorystorage storage; File Size161KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM100469FC Overview

Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24

AM100469FC Parametric

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	DFP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	9.5 ns
Other features	ON-CHIP PARITY GENERATOR AND CHECKER
JESD-30 code	R-CDFP-F24
length	15.367 mm
memory density	4608 bit
Memory IC Type	CACHE TAG SRAM
memory width	9
Number of functions	1
Number of terminals	24
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	512X9
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	2.286 mm
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	9.525 mm
Base Number Matches	1

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AM100469FC Related Products

	AM100469FC	AM10469FC	AM100469DC	AM10469DC
Description	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24
Parts packaging code	DFP	DFP	DIP	DIP
package instruction	DFP,	DFP,	DIP, DIP24,.4	DIP, DIP24,.4
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	9.5 ns	9.5 ns	9.5 ns	9.5 ns
Other features	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER
JESD-30 code	R-CDFP-F24	R-CDFP-F24	R-GDIP-T24	R-GDIP-T24
length	15.367 mm	15.367 mm	30.5435 mm	30.5435 mm
memory density	4608 bit	4608 bit	4608 bit	4608 bit
Memory IC Type	CACHE TAG SRAM	CACHE TAG SRAM	CACHE TAG SRAM	CACHE TAG SRAM
memory width	9	9	9	9
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
word count	512 words	512 words	512 words	512 words
character code	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	75 °C	85 °C	75 °C
organize	512X9	512X9	512X9	512X9
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	DFP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.286 mm	2.286 mm	5.588 mm	5.588 mm
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	COMMERCIAL EXTENDED	OTHER	COMMERCIAL EXTENDED
Terminal form	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	9.525 mm	9.525 mm	10.16 mm	10.16 mm
Maker	-	AMD	AMD	AMD

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