Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.4 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 9.5 ns |
| Other features | ON-CHIP PARITY GENERATOR AND CHECKER |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 30.5435 mm |
| memory density | 4608 bit |
| Memory IC Type | CACHE TAG SRAM |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 512X9 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.588 mm |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| AM10469DC | AM100469FC | AM10469FC | AM100469DC | |
|---|---|---|---|---|
| Description | Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24 | Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24 | Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24 |
| Parts packaging code | DIP | DFP | DFP | DIP |
| package instruction | DIP, DIP24,.4 | DFP, | DFP, | DIP, DIP24,.4 |
| Contacts | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
| Other features | ON-CHIP PARITY GENERATOR AND CHECKER | ON-CHIP PARITY GENERATOR AND CHECKER | ON-CHIP PARITY GENERATOR AND CHECKER | ON-CHIP PARITY GENERATOR AND CHECKER |
| JESD-30 code | R-GDIP-T24 | R-CDFP-F24 | R-CDFP-F24 | R-GDIP-T24 |
| length | 30.5435 mm | 15.367 mm | 15.367 mm | 30.5435 mm |
| memory density | 4608 bit | 4608 bit | 4608 bit | 4608 bit |
| Memory IC Type | CACHE TAG SRAM | CACHE TAG SRAM | CACHE TAG SRAM | CACHE TAG SRAM |
| memory width | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 |
| word count | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C | 85 °C | 75 °C | 85 °C |
| organize | 512X9 | 512X9 | 512X9 | 512X9 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP | DFP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.588 mm | 2.286 mm | 2.286 mm | 5.588 mm |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | OTHER | COMMERCIAL EXTENDED | OTHER |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| width | 10.16 mm | 9.525 mm | 9.525 mm | 10.16 mm |
| Maker | AMD | - | AMD | AMD |
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