AM100469DC datasheet, PDF - EEWORLD Datasheet

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AM100469DC: DescriptionCache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24; Categorystorage storage; File Size161KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM100469DC Overview

Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24

AM100469DC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP24,.4
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	9.5 ns
Other features	ON-CHIP PARITY GENERATOR AND CHECKER
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	30.5435 mm
memory density	4608 bit
Memory IC Type	CACHE TAG SRAM
memory width	9
Number of functions	1
Number of terminals	24
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	512X9
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.4
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.588 mm
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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AM100469DC Related Products

	AM100469DC	AM100469FC	AM10469FC	AM10469DC
Description	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDFP24, CERAMIC, FP-24	Cache Tag SRAM, 512X9, 9.5ns, CMOS, CDIP24, 0.400 INCH, CERAMIC, DIP-24
Parts packaging code	DIP	DFP	DFP	DIP
package instruction	DIP, DIP24,.4	DFP,	DFP,	DIP, DIP24,.4
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	9.5 ns	9.5 ns	9.5 ns	9.5 ns
Other features	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER	ON-CHIP PARITY GENERATOR AND CHECKER
JESD-30 code	R-GDIP-T24	R-CDFP-F24	R-CDFP-F24	R-GDIP-T24
length	30.5435 mm	15.367 mm	15.367 mm	30.5435 mm
memory density	4608 bit	4608 bit	4608 bit	4608 bit
Memory IC Type	CACHE TAG SRAM	CACHE TAG SRAM	CACHE TAG SRAM	CACHE TAG SRAM
memory width	9	9	9	9
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
word count	512 words	512 words	512 words	512 words
character code	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	75 °C	75 °C
organize	512X9	512X9	512X9	512X9
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DFP	DFP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.588 mm	2.286 mm	2.286 mm	5.588 mm
surface mount	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal form	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	10.16 mm	9.525 mm	9.525 mm	10.16 mm
Maker	AMD	-	AMD	AMD

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