XC4062XLTHQ240 datasheet, PDF - EEWORLD Datasheet

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XC4062XLTHQ240: DescriptionField Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240; CategoryProgrammable logic devices Programmable logic; File Size752KB，12 Pages; ManufacturerXILINX; Websitehttps://www.xilinx.com/

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XC4062XLTHQ240 Overview

Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240

XC4062XLTHQ240 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	HFQFP,
Contacts	240
Reach Compliance Code	compliant
JESD-30 code	S-PQFP-G240
JESD-609 code	e0
length	32 mm
Humidity sensitivity level	3
Configurable number of logic blocks	2304
Equivalent number of gates	40000
Number of terminals	240
organize	2304 CLBS, 40000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	HFQFP
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	4.1 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	32 mm
Base Number Matches	1

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XC4062XLTHQ240 Related Products

	XC4062XLTHQ240	XC4062XLTBGG432	XC4062XLTBG432	XC4028XLTHQ240
Description	Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PBGA432, CAVITY DOWN, PLASTIC, BGA-432	Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PBGA432, CAVITY DOWN, PLASTIC, BGA-432	Field Programmable Gate Array, 1024 CLBs, 18000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240
Is it lead-free?	Contains lead	Lead free	Contains lead	Contains lead
Is it Rohs certified?	incompatible	conform to	incompatible	incompatible
Parts packaging code	QFP	BGA	BGA	QFP
package instruction	HFQFP,	CAVITY DOWN, PLASTIC, BGA-432	CAVITY DOWN, PLASTIC, BGA-432	HEAT SINK, PLASTIC, QFP-240
Contacts	240	432	432	240
Reach Compliance Code	compliant	compliant	compliant	compliant
JESD-30 code	S-PQFP-G240	S-PBGA-B432	S-PBGA-B432	S-PQFP-G240
JESD-609 code	e0	e1	e0	e0
length	32 mm	40 mm	40 mm	32 mm
Humidity sensitivity level	3	3	3	3
Configurable number of logic blocks	2304	2304	2304	1024
Equivalent number of gates	40000	40000	40000	18000
Number of terminals	240	432	432	240
organize	2304 CLBS, 40000 GATES	2304 CLBS, 40000 GATES	2304 CLBS, 40000 GATES	1024 CLBS, 18000 GATES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HFQFP	LBGA	LBGA	HFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)	225	260	225	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.1 mm	1.7 mm	1.7 mm	4.1 mm
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Terminal surface	TIN LEAD	TIN SILVER COPPER	TIN LEAD	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	BALL	BALL	GULL WING
Terminal pitch	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	QUAD	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	30	30	30	30
width	32 mm	40 mm	40 mm	32 mm
Maker	-	XILINX	XILINX	XILINX

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