1.1 Objective of the Specifications ..................................................................................................................... 3
1.2 Definition of the Chip Module ..................................................................................................................... 3
1.3 Use of the Modules ...................................................................................................................................... 3
2.3 Temperature Range ..................................................................................................................................... 4
3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7
3.1 Drawing of the Reel..................................................................................................................................... 7
5.3 Operation Modes and Configuration .......................................................................................................... 14
5.3.1 Modes of Operation............................................................................................................................ 14
5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17
5.5 Definition of Keys and Logdata ................................................................................................................. 17
7 Characterisation and Test of the Final Transponder......................................................... 20
7.1 Characterisation of the Transponder .......................................................................................................... 20
7.2 Final Test of the Transponder .................................................................................................................... 20
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Embedded System
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