HT1 MOA3 S30
HITAG 1 Chip Module
Preliminary Specification
Revision 1.1
August 1997
TM
Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Table of Contents
1 Definitions .............................................................................................................................. 3
1.1 Objective of the Specifications ..................................................................................................................... 3
1.2 Definition of the Chip Module ..................................................................................................................... 3
1.3 Use of the Modules ...................................................................................................................................... 3
2 Specifications ......................................................................................................................... 4
2.1 Mechanical Properties ................................................................................................................................. 4
2.2 Materials ..................................................................................................................................................... 4
2.3 Temperature Range ..................................................................................................................................... 4
2.4 Storage Conditions ...................................................................................................................................... 5
2.5 Delivery Conditions..................................................................................................................................... 5
2.6 Electrical Specifications............................................................................................................................... 6
3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7
3.1 Drawing of the Reel..................................................................................................................................... 7
3.2 Module outline suggestion ........................................................................................................................... 8
3.3 Splicing Specification .................................................................................................................................. 9
4 Coil Specifications................................................................................................................ 10
5 Functional Description of HITAG 1 ................................................................................... 12
5.1 Memory Organization................................................................................................................................ 12
5.2 Anticollision.............................................................................................................................................. 13
5.3 Operation Modes and Configuration .......................................................................................................... 14
5.3.1 Modes of Operation............................................................................................................................ 14
5.3.2 Configuration..................................................................................................................................... 14
5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17
5.5 Definition of Keys and Logdata ................................................................................................................. 17
6 Quality Inspection ............................................................................................................... 19
7 Characterisation and Test of the Final Transponder......................................................... 20
7.1 Characterisation of the Transponder .......................................................................................................... 20
7.2 Final Test of the Transponder .................................................................................................................... 20
8 Ordering Information.......................................................................................................... 21
HITAG
TM
is a trademark of Philips Electronics N.V.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 1 chip module
HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The
HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.
So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 1 chip module.
1.3 Use of the Modules
The HITAG 1 modules are designed to be connected to a coil and then to be further processed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2 Specifications
2.1 Mechanical Properties
Width
7.55 mm
(Proposed Punching Outline)
Length
11.75 mm
(Proposed Punching Outline)
Overall Thickness
Film Thickness
Bondpad Size for
Transponder Coil / Module
Interconnection
0.45 mm ± 0.03 mm
0.16 mm ± 0.005 mm
1.9 x 3.5 mm
Suitable for Welding/Soldering/
Conductive Gluing
see also drawing in chapter 3
2.2 Materials
Tape
Copper Plating
Bond Plating
Backside Plating
Glob Top
110 µm
35 µm
Ni / Au
Ni / Au
Filled Epoxy
Thermal curing
Glass epoxy
ED copper
Suitable for Al and Au wire
bonding
2.3 Temperature Range
Operating
Processing
-25°C to +85°C
150°C for 30 minutes
For packed transponder,
depending on type of package
at a standard lamination
pressure for contactless smart
card plastic materials (e.g. PVC,
PET, ...)
on bond pads
on bond pads
Welding Parameters
Soldering Parameters
max. 25 ms @ 500 °C
max. 3 s @ 390 °C
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2.4 Storage Conditions
Temperature
Relative Humidity
Duration
15 - 30 °C
40 - 70 %
1 year
2.5 Delivery Conditions
Delivery Identification
Date of ready for shipment, reel numbers, total quantity of good
modules with the detail of good modules per reel, order number,
product type, no supplier identification on reels, bags and boxes.
Chip modules on reel
approx. 15.000 to 20.000
pcs. per reel,
tape width super 35 mm,
pitch 9,5 mm, 2 rows
500 pcs . per bag
Order-No. 3322 845 04881
Types of Delivery
single chip modules (bulk goods)
Packing and Transport
According to documentation
"Packing Method Modules (reel)"
"Packing Method Modules (singulated)"
Bad Module Marking
All bad modules (mechanical and
electrical faults) must be punched by
reject hole for customer
Bad positions (reel): <20%
Splicing Specifications
Tape material: adhes. tape 15,5 +/- 0,7
mm, thermal resistance at
<190°C by < 100 cN tractive power and
< 30 sec. duration.
Identification label on the reel and on
carton bag:
- Product type
- Number of the reel
- Total number of positions
- Number of good positions
- Date of sealing (to be checked)
- Two batches per reel only
- Batchnumber indication (only coded,
to be checked)
see drawings chapter 3
see drawings chapter 3
Labeling
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