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CY7C1460AV25-250AC

Description
ZBT SRAM, 1MX36, 2.6ns, CMOS, PQFP100
Categorystorage    storage   
File Size382KB,27 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

CY7C1460AV25-250AC Overview

ZBT SRAM, 1MX36, 2.6ns, CMOS, PQFP100

CY7C1460AV25-250AC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instructionTQFP-100
Reach Compliance Codecompliant
Maximum access time2.6 ns
Maximum clock frequency (fCLK)250 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density37748736 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8/2.5,2.5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.1 A
Minimum standby current2.38 V
Maximum slew rate0.41 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1
PRELIMINARY
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM
with NoBL™ Architecture
Features
• Pin-compatible and functionally equivalent to ZBT™
• Supports 250-MHz bus operations with zero wait states
— Available speed grades are 250, 200 and 167MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• Single 2.5V power supply
• 2.5V/1.8V I/O operation
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
— 3.0 ns (for 200-MHz device)
— 3.4 ns (for 167-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• CY7C1460AV25 and CY7C1462AV25 available in 100
TQFP and 165 fBGA packages CY7C1464AV25 available
in 209-Ball fBGA package
• IEEE 1149.1 JTAG Boundary Scan
• Burst capability—linear or interleaved burst order
• “ZZ” Sleep Mode option and Stop Clock option
Functional Description
The CY7C1460AV25/CY7C1462AV25/CY7C1464AV25 are
2.5V, 1M x 36 / 2M x 18 /Synchronous pipelined burst SRAMs
with No Bus Latency™ (NoBL™) logic, respectively. They are
designed to support unlimited true back-to-back Read/Write
operations with no wait states. The CY7C1460AV25/
CY7C1462AV25/CY7C1464AV25 are equipped with the
advanced (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data in systems that require frequent Write/Read transitions.
The CY7C1460AV25/ CY7C1462AV25/ CY7C1464AV25 are
pin compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle. Write operations are controlled by the
Byte Write Selects (BW
a
–BW
h
for CY7C1464AV25,
BW
a
–BW
d
for CY7C1460AV25 and BW
a
–BW
b
for
CY7C1462AV25) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
Logic Block Diagram-CY7C1460AV25 (1M x 36)
A0, A1, A
MODE
CLK
CEN
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
C
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
a
DQP
b
DQP
c
DQP
d
E
INPUT
REGISTER 1
E
INPUT
REGISTER 0
E
OE
CE1
CE2
CE3
ZZ
READ LOGIC
SLEEP
CONTROL
Cypress Semiconductor Corporation
Document #: 38-05354 Rev. **
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised August 12, 2004

CY7C1460AV25-250AC Related Products

CY7C1460AV25-250AC CY7C1464AV25-225BGC CY7C1462AV25-200AC CY7C1462AV25-167AC CY7C1460AV25-225AC CY7C1460AV25-225BZC CY7C1462AV25-225BZC
Description ZBT SRAM, 1MX36, 2.6ns, CMOS, PQFP100 ZBT SRAM, 512KX72, CMOS, PBGA209, ZBT SRAM, 2MX18, 3ns, CMOS, PQFP100 ZBT SRAM, 2MX18, 3.4ns, CMOS, PQFP100 ZBT SRAM, 1MX36, CMOS, PQFP100, ZBT SRAM, 1MX36, CMOS, PBGA165, ZBT SRAM, 2MX18, CMOS, PBGA165,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction TQFP-100 FBGA-209 TQFP-100 TQFP-100 TQFP-100 FBGA-165 FBGA-165
Reach Compliance Code compliant compliant compliant compliant compliant compli compli
Maximum clock frequency (fCLK) 250 MHz 225 MHz 200 MHz 167 MHz 225 MHz 225 MHz 225 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PBGA-B209 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PBGA-B165 R-PBGA-B165
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 20 mm 22 mm 20 mm 20 mm 20 mm 17 mm 17 mm
memory density 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bi 37748736 bi
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 36 72 18 18 36 36 18
Number of functions 1 1 1 1 1 1 1
Number of terminals 100 209 100 100 100 165 165
word count 1048576 words 524288 words 2097152 words 2097152 words 1048576 words 1048576 words 2097152 words
character code 1000000 512000 2000000 2000000 1000000 1000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX36 512KX72 2MX18 2MX18 1MX36 1MX36 2MX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP BGA LQFP LQFP LQFP LBGA LBGA
Encapsulate equivalent code QFP100,.63X.87 BGA209,11X19,40 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 BGA165,11X15,40 BGA165,11X15,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.8/2.5,2.5 V 1.8/2.5,2.5 V 1.8/2.5,2.5 V 1.8/2.5,2.5 V 1.8/2.5,2.5 V 1.8/2.5,2.5 V 1.8/2.5,2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.96 mm 1.6 mm 1.6 mm 1.6 mm 1.4 mm 1.4 mm
Maximum standby current 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A
Minimum standby current 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL GULL WING GULL WING GULL WING BALL BALL
Terminal pitch 0.65 mm 1 mm 0.65 mm 0.65 mm 0.65 mm 1 mm 1 mm
Terminal location QUAD BOTTOM QUAD QUAD QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm 14 mm 14 mm 14 mm 14 mm 15 mm 15 mm
Base Number Matches 1 1 1 1 - - -

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