(1/2)
Circulators/Isolators
SMD
CU Series CU452
SHAPES AND DIMENSIONS
5±0.3
0.4±0.1
TERMINAL FUNCTIONS
No.
1
2
3
4
5
6
A(CW)
IN
GND
GND
GND
GND
OUT
B(CCW)
OUT
GND
GND
GND
GND
IN
4
5±0.3
3
2
5
6
1
0.8
Steel
(Plating solder)
1.9±0.1
Liquid crystal
polymer
0.7
+0.15
0.7
+0.15
0.7
+0.15
–0.1
–0.1
–0.1
1.9
1.9
Terminal
(Plating solder)
Tolerance:
±0.2
Weight: 0.22g
0.5
+0.15
–0.1
0.5
+0.15
–0.1
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
LAND
Isolator outline
GND
SOLDER RESIST
Solder resist
1
1
(1) 1.9
1min.
Connect to 50Ω stripline
with I/O land
1min.
I/O
I/O
1.15
3.8
1
1.9
1.9
Terminal
Dimensions in mm
(1.15)
1min.
3.8
Terminal
Dimensions in mm
• All specifications are subject to change without notice.
001-01 / 20070627 / e771_cu452.fm
(2/2)
ELECTRICAL CHARACTERISTICS
CU452
∗1
1F-
∗2
-1TE2 (5x5x2mm Isolator)
∗1
∗2
Direction CW-'A' or CCW-'B'
Center frequency
Other frequencies available on your request.
Isolation
(dB)
min.
14
14
13
14
14
14
Insertion loss
(dB)
max.
0.65
0.7
0.7
0.6
0.6
0.6
VSWR
max.
Z
0
=50Ω
1.5
1.5
1.5
1.5
1.5
1.5
2.5
0.6
∗
–35 to +85
0.22
Handling
power
(W)
Capacity of
built-in resistor
(W)
Temperature
range
(°C)
Weight
(g)
Frequency
Center
Use
range
frequency
(MHz)
(MHz)
824 to 849
836.5
Cellular
869 to 894
881.5
880 to 915
897.5
GSM900
925 to 960
942.5
1710 to 1785
1747.5
DCS
1805 to 1880
1842.5
1850 to 1910
1880
PCS
190 to 1990
1960
TD-SCDMA
2010 to 2025
2017.5
1920 to 1980
1950
WCDMA
2110 to 2170
2140
∗
Bottom surface to be kept below +85°C.
• All specifications are subject to change without notice.
001-01 / 20070627 / e771_cu452.fm
stm32/stm8
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