DS0026J-8 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > logic> logic> DS0026J-8

DS0026J-8: DescriptionIC,DUAL 1:1 OUTPUT,BIPOLAR,DIP,8PIN,CERAMIC; Categorylogic logic; File Size184KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

Stay tuned Parametric Compare

DS0026J-8 Overview

IC,DUAL 1:1 OUTPUT,BIPOLAR,DIP,8PIN,CERAMIC

DS0026J-8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T8
JESD-609 code	e0
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

DS0026J-8 Related Products

	DS0026J-8	DS0026CJ	DS0026CJ-8	DS0026G-MIL	DS0026CMAX	DS0026CMMX
Description	IC,DUAL 1:1 OUTPUT,BIPOLAR,DIP,8PIN,CERAMIC	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), CDIP14, CERAMIC, DIP-14, Clock Driver	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), CDIP8, CERAMIC, DIP-8, Clock Driver	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), MBCY12, Clock Driver	IC,DUAL 1:1 OUTPUT,BIPOLAR,SOP,8PIN,PLASTIC	IC,DUAL 1:1 OUTPUT,BIPOLAR,TSSOP,8PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP14,.3	DIP, DIP8,.3	QIP, QUAD12,.4SQ	SOP, SOP8,.25	TSSOP, TSSOP8,.19
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T8	R-GDIP-T14	R-GDIP-T8	O-MBCY-W12	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	8	14	8	12	8	8
Maximum operating temperature	125 °C	70 °C	70 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	METAL	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QIP	SOP	TSSOP
Encapsulate equivalent code	DIP8,.3	DIP14,.3	DIP8,.3	QUAD12,.4SQ	SOP8,.25	TSSOP8,.19
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CYLINDRICAL	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	YES	YES
technology	BIPOLAR	CMOS	CMOS	MOS	BIPOLAR	BIPOLAR
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	WIRE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL
MaximumI(ol)	-	0.001 A	0.001 A	-	0.001 A	0.001 A

Recommended Resources

How to solve the problem that the battery of MacBook Pro is not charging after plugging it in?

Refrigerator compressor working principle circuit diagram

Use CD4011 to make light-controlled flashing warning lights

three phase detector

A method for low-speed operation of three-phase asynchronous motor

Key switch circuit

MSP430ware 1.00.00: First, let me introduce what MSP430ware 1.00.00 is.MSP430ware 1.00.00 is a collection of sample codes, user manuals, and other design resources.After installation, you can use this software to search ...; wstt Microcontroller MCU

Compiler macro definition [Solve...]: For example, I am using 430 now, and the code written by others is: TA1CCR0 = PWM_DEPTH-1; // PWM Period TA1CCTL1 = OUTMOD_7; // CCR1 reset/set TA1CCTL2 = OUTMOD_7; //OUTMOD_6 reverse polarity TA1CCR1...; dxhhxd Microcontroller MCU

How much do you need to learn STM32 to get started? There are too many things I am not used to when switching from 51 to STM32.: From campus study to internship work means a lot of changes. I learned the 51 MCU series on campus, but my internship requires me to learn STM32. The leap is still quite big, and there are too many th...; generalcircuits stm32/stm8

Design and implementation of ZigBee wireless sensor network: This book is aimed at beginners who are determined to develop ZigBee wireless sensor networks and engineers who are transitioning to wireless network development. It introduces the basic theories of Z...; arui1999 Download Centre

Ask about PCI experience: I am studying PCI communication. I want to use the PCI core (master) of FPGA to communicate with the network card (slave) without adding a ruling device in the middle. I wonder if there is any problem...; eeleader FPGA/CPLD

Practical Analog Circuit Design Technology Collection: Practical Analog Circuit Design Technology-Section 1...; fighting Analog electronics

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components