DS0026G-MIL datasheet, PDF - EEWORLD Datasheet

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DS0026G-MIL: DescriptionIC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), MBCY12, Clock Driver; Categorylogic logic; File Size184KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DS0026G-MIL Overview

IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), MBCY12, Clock Driver

DS0026G-MIL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	QIP, QUAD12,.4SQ
Reach Compliance Code	unknown
series	DS00
Input adjustment	STANDARD
JESD-30 code	O-MBCY-W12
JESD-609 code	e0
Logic integrated circuit type	LOW SKEW CLOCK DRIVER
Number of functions	2
Number of inverted outputs	1
Number of terminals	12
Actual output times
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	METAL
encapsulated code	QIP
Encapsulate equivalent code	QUAD12,.4SQ
Package shape	ROUND
Package form	CYLINDRICAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	19 ns
Certification status	Not Qualified
Filter level	MIL-STD-883
surface mount	NO
technology	MOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	WIRE
Terminal pitch	2.54 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
minfmax	5 MHz

DS0026G-MIL Related Products

	DS0026G-MIL	DS0026CJ	DS0026CJ-8	DS0026J-8	DS0026CMAX	DS0026CMMX
Description	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), MBCY12, Clock Driver	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), CDIP14, CERAMIC, DIP-14, Clock Driver	IC LOW SKEW CLOCK DRIVER, 0 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), CDIP8, CERAMIC, DIP-8, Clock Driver	IC,DUAL 1:1 OUTPUT,BIPOLAR,DIP,8PIN,CERAMIC	IC,DUAL 1:1 OUTPUT,BIPOLAR,SOP,8PIN,PLASTIC	IC,DUAL 1:1 OUTPUT,BIPOLAR,TSSOP,8PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QIP, QUAD12,.4SQ	DIP, DIP14,.3	DIP, DIP8,.3	DIP, DIP8,.3	SOP, SOP8,.25	TSSOP, TSSOP8,.19
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	O-MBCY-W12	R-GDIP-T14	R-GDIP-T8	R-XDIP-T8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	12	14	8	8	8	8
Maximum operating temperature	125 °C	70 °C	70 °C	125 °C	70 °C	70 °C
Package body material	METAL	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QIP	DIP	DIP	DIP	SOP	TSSOP
Encapsulate equivalent code	QUAD12,.4SQ	DIP14,.3	DIP8,.3	DIP8,.3	SOP8,.25	TSSOP8,.19
Package shape	ROUND	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CYLINDRICAL	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	YES	YES
technology	MOS	CMOS	CMOS	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	WIRE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	0.635 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL
MaximumI(ol)	-	0.001 A	0.001 A	-	0.001 A	0.001 A

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