DS2009DN-65 datasheet, PDF - EEWORLD Datasheet

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DS2009DN-65: DescriptionFIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28,; Categorystorage storage; File Size800KB，14 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS2009DN-65 Overview

FIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28,

DS2009DN-65 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	unknown
Maximum access time	65 ns
Maximum clock frequency (fCLK)	12.5 MHz
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X9
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.008 A
Maximum slew rate	0.1 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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DS2009DN-65 Related Products

	DS2009DN-65	DS2009RN-65	DS2009RN-80	DS2009DN-80
Description	FIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28,	FIFO, 512X9, 65ns, Asynchronous, CMOS, PQCC32,	FIFO, 512X9, 80ns, Asynchronous, CMOS, PQCC32,	FIFO, 512X9, 80ns, Asynchronous, CMOS, PDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	65 ns	65 ns	80 ns	80 ns
Maximum clock frequency (fCLK)	12.5 MHz	12.5 MHz	10 MHz	10 MHz
JESD-30 code	R-PDIP-T28	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9
Number of terminals	28	32	32	28
word count	512 words	512 words	512 words	512 words
character code	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	512X9	512X9	512X9	512X9
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	QCCJ	DIP
Encapsulate equivalent code	DIP28,.3	LDCC32,.5X.6	LDCC32,.5X.6	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.008 A	0.008 A	0.008 A	0.008 A
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1

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