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R5F213G4ANNP Overview

RENESAS MCU

R5F213G4ANNP Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeQFN
package instructionHVQCCN, LCC24,.16SQ,20
Contacts24
Reach Compliance Codeunknow
Has ADCYES
Address bus width
bit size8
maximum clock frequency20 MHz
DAC channelYES
DMA channelNO
External data bus width
JESD-30 codeS-PQCC-N24
length4 mm
Number of I/O lines20
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC24,.16SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
power supply2/5 V
Certification statusNot Qualified
RAM (bytes)1536
rom(word)16384
ROM programmabilityFLASH
Maximum seat height0.8 mm
speed20 MHz
Maximum slew rate15 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width4 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
R8C/3GA Group
RENESAS MCU
REJ03B0235-0110
Rev.1.10
Sep. 10, 2009
1.
1.1
Overview
Features
The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/3GA Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 1 of 53

R5F213G4ANNP Related Products

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Description RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation -
Parts packaging code QFN QFN QFN QFN QFN QFN QFN QFN -
package instruction HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 HVQCCN, LCC24,.16SQ,20 HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 -
Contacts 24 24 24 24 24 24 24 24 -
Reach Compliance Code unknow compli compli compli compli unknow compli compli -
Has ADC YES YES YES YES YES YES YES YES -
bit size 8 8 8 8 8 8 8 8 -
maximum clock frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
DAC channel YES YES YES YES YES YES YES YES -
DMA channel NO NO NO NO NO NO NO NO -
JESD-30 code S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 -
length 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm -
Number of I/O lines 20 20 20 20 20 20 20 20 -
Number of terminals 24 24 24 24 24 24 24 24 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -20 °C -40 °C -20 °C -40 °C -40 °C -20 °C -40 °C -20 °C -
PWM channel YES YES YES YES YES YES YES YES -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN -
Encapsulate equivalent code LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 -
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE -
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
power supply 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
RAM (bytes) 1536 1024 1024 2048 2560 2048 1536 2560 -
rom(word) 16384 8192 8192 24576 32768 24576 16384 32768 -
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH -
Maximum seat height 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm -
speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
Maximum slew rate 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA -
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V -
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V -
surface mount YES YES YES YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level OTHER INDUSTRIAL OTHER INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL OTHER -
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD -
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm -
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD -
width 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER -
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