R8C/3GA Group
RENESAS MCU
REJ03B0235-0110
Rev.1.10
Sep. 10, 2009
1.
1.1
Overview
Features
The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/3GA Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 1 of 53
R8C/3GA Group
1. Overview
1.1.2
Specifications
Tables 1.1 and 1.2 outline the Specifications for R8C/3GA Group.
Table 1.1
Item
CPU
Specifications for R8C/3GA Group (1)
Function
Central processing
unit
Specification
R8C CPU core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V)
• Multiplier: 16 bits × 16 bits
→
32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits
→
32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to
Table 1.3 Product List for R8C/3GA Group.
• Power-on reset
• Voltage detection 3 (detection level of voltage detection 0 and voltage
detection 1 selectable)
• Input-only: 1 pin
• CMOS I/O ports: 19, selectable pull-up resistor
• High current drive ports: 19
• 3 circuits: XIN clock oscillation circuit,
XCIN clock oscillation circuit (32 kHz),
Low-speed on-chip oscillator
• Oscillation stop detection: XIN clock oscillation stop detection function
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (high-speed clock, low-speed clock, low-speed on-
chip oscillator), wait mode, stop mode
Real-time clock (timer RE)
• Number of interrupt vectors: 69
• External Interrupt: 7 (INT × 3, Key input × 4)
• Priority levels: 7 levels
• 14 bits × 1 (with prescaler)
• Reset start selectable
• Low-speed on-chip oscillator for watchdog timer selectable
• 1 channel
• Activation sources: 23
• Transfer modes: 2 (normal mode, repeat mode)
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait one-
shot generation mode
16 bits × 1 (with 4 capture/compare registers)
Timer mode (input capture function, output compare function), PWM mode
(output 3 pins), PWM2 mode (PWM output pin)
8 bits × 1
Real-time clock mode (count seconds, minutes, hours, days of week)
Memory
ROM, RAM, Data
flash
Power Supply Voltage detection
Voltage
circuit
Detection
I/O Ports
Programmable I/O
ports
Clock
Clock generation
circuits
Interrupts
Watchdog Timer
DTC (Data Transfer Controller)
Timer
Timer RA
Timer RB
Timer RC
Timer RE
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 2 of 53
R8C/3GA Group
1. Overview
Table 1.2
Item
Serial
Interface
Specifications for R8C/3GA Group (2)
Function
UART0
UART2
Specification
Clock synchronous serial I/O/UART
Clock synchronous serial I/O/UART, I
2
C mode (I
2
C-bus),
multiprocessor communication function
1 (shared with I
2
C-bus)
1 (shared with SSU)
Hardware LIN: 1 (timer RA, UART0)
10-bit resolution × 8 channels, includes sample and hold function, with sweep
mode
8-bit resolution × 2 circuits
• 2 circuits (shared with voltage monitor 1 and voltage monitor 2)
• External reference voltage input available
2 circuits
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 10,000 times (data flash)
1,000 times (program ROM)
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
• Background operation (BGO) function
f(XIN) = 20 MHz (VCC = 2.7 to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 to 5.5 V)
Typ. 6.5 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 3.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 3.5
µA
(VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz))
Typ. 2.0
µA
(VCC = 3.0 V, stop mode)
-20 to 85°C (N version)
-40 to 85°C (D version)
(1)
24-pin HWQFN
Package code: PWQN0024KC-A
Synchronous Serial
Communication Unit (SSU)
I
2
C bus
LIN Module
A/D Converter
D/A Converter
Comparator A
Comparator B
Flash Memory
Operating Frequency/Supply
Voltage
Current Consumption
Operating Ambient Temperature
Package
Note:
1. Specify the D version if D version functions are to be used.
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 3 of 53
R8C/3GA Group
1. Overview
1.2
Product List
Table 1.3 lists Product List for R8C/3GA Group, and Figure 1.1 shows a Part Number, Memory Size, and Package
of R8C/3GA Group.
Table 1.3
Product List for R8C/3GA Group
ROM Capacity
Program ROM
Data flash
8 Kbytes
1 Kbyte
×
4
16 Kbytes
1 Kbyte
×
4
24 Kbytes
1 Kbyte
×
4
32 Kbytes
1 Kbyte
×
4
8 Kbytes
1 Kbyte
×
4
16 Kbytes
1 Kbyte
×
4
24 Kbytes
1 Kbyte
×
4
32 Kbytes
1 Kbyte
×
4
RAM
Capacity
1 Kbyte
1.5 Kbytes
2 Kbytes
2.5 Kbytes
1 Kbyte
1.5 Kbytes
2 Kbytes
2.5 Kbytes
Current of Jul. 2009
Package Type
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
PWQN0024KC-A
Remarks
N version
Part No.
R5F213G2ANNP
R5F213G4ANNP
R5F213G5ANNP
R5F213G6ANNP
R5F213G2ADNP (P)
R5F213G4ADNP (P)
R5F213G5ADNP (P)
R5F213G6ADNP (P)
(P): Under planning
D version
Part No.
R 5 F 21 3G 6 A N NP
Package type:
NP: PWQN0024KC-A (0.5 mm pin-pitch, 4 mm square body)
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
ROM capacity
2: 8 KB
4: 16 KB
5: 24 KB
6: 32 KB
R8C/3GA Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1
Part Number, Memory Size, and Package of R8C/3GA Group
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 4 of 53
R8C/3GA Group
1. Overview
1.3
Block Diagram
Figure 1.2 shows a Block Diagram.
4
8
4
3
1
I/O ports
Peripheral functions
Timers
Timer RA (8 bits
×
1)
Timer RB (8 bits
×
1)
Timer RC (16 bits
×
1)
Timer RE (8 bits
×
1)
Port P0
Port P1
Port P3
Port P4
UART or
clock synchronous serial I/O
(8 bits
×
2)
I
2
C bus or SSU
(8 bits
×
1)
System clock generation
circuit
XIN-XOUT
Low-speed on-chip oscillator
XCIN-XCOUT
LIN module
Watchdog timer
(14 bits)
Comparator B
A/D converter
(10 bits
×
8 channels)
D/A converter
(8 bits
×
2)
DTC
Voltage detection circuit
Low-speed on-chip oscillator
for watchdog timer
Comparator A
R8C CPU core
R0H
R1H
R2
R3
A0
A1
FB
R0L
R1L
SB
USP
ISP
INTB
PC
FLG
Memory
ROM
(1)
RAM
(2)
Multiplier
Notes:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.2
Block Diagram
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 5 of 53
ARM Technology
京公网安备 11010802033920号
EEWORLD
