EEWORLDEEWORLDEEWORLD

Part Number

Search

R5F213G5ADNP Overview

RENESAS MCU

R5F213G5ADNP Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeQFN
package instructionHVQCCN, LCC24,.16SQ,20
Contacts24
Reach Compliance Codecompli
Has ADCYES
Address bus width
bit size8
CPU seriesR8C
maximum clock frequency20 MHz
DAC channelYES
DMA channelNO
External data bus width
JESD-30 codeS-PQCC-N24
length4 mm
Number of I/O lines20
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC24,.16SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
power supply2/5 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)24576
ROM programmabilityFLASH
Maximum seat height0.8 mm
speed20 MHz
Maximum slew rate15 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width4 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
R8C/3GA Group
RENESAS MCU
REJ03B0235-0110
Rev.1.10
Sep. 10, 2009
1.
1.1
Overview
Features
The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/3GA Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
REJ03B0235-0110 Rev.1.10 Sep. 10, 2009
Page 1 of 53

R5F213G5ADNP Related Products

R5F213G5ADNP R5F213G2ADNP R5F213G2ANNP R5F213G4ANNP R5F213G6ADNP R5F213G5ANNP R5F213G4ADNP R5F213G6ANNP R8C3GA
Description RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation -
Parts packaging code QFN QFN QFN QFN QFN QFN QFN QFN -
package instruction HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 HVQCCN, LCC24,.16SQ,20 HVQCCN, LCC24,.16SQ,20 4 X 4 MM, 0.50 MM PITCH, PLASTIC, QFN-24 -
Contacts 24 24 24 24 24 24 24 24 -
Reach Compliance Code compli compli compli unknow compli unknow compli compli -
Has ADC YES YES YES YES YES YES YES YES -
bit size 8 8 8 8 8 8 8 8 -
maximum clock frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
DAC channel YES YES YES YES YES YES YES YES -
DMA channel NO NO NO NO NO NO NO NO -
JESD-30 code S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 S-PQCC-N24 -
length 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm -
Number of I/O lines 20 20 20 20 20 20 20 20 -
Number of terminals 24 24 24 24 24 24 24 24 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -20 °C -20 °C -40 °C -20 °C -40 °C -20 °C -
PWM channel YES YES YES YES YES YES YES YES -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN -
Encapsulate equivalent code LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 LCC24,.16SQ,20 -
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE -
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
power supply 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
RAM (bytes) 2048 1024 1024 1536 2560 2048 1536 2560 -
rom(word) 24576 8192 8192 16384 32768 24576 16384 32768 -
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH -
Maximum seat height 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm -
speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
Maximum slew rate 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA -
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V -
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V -
surface mount YES YES YES YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL OTHER OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER -
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD -
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm -
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD -
width 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm 4 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER -
Quantum Ginza-Free Red Bull!!!
As the title says, when I heard the news, I immediately went to the forum to share the news with my friends in Xinzuo Ginza Home! Register to get Red Bull! Hurry up and register! [url=http://www.redbu...
重虫 Talking
Configuring the DriverStudio Development Environment
After two days of hard work, the driver development environment can finally work. Below I write down the problems I encountered and the final configuration plan to share and exchange with everyone. 1....
ashsworld Embedded System
What is the prospect of PCB proofing? Please give me some advice.
I just started working in this industry. I don’t know what the development prospects of this industry are. Will this industry develop quickly in the future? The main consideration is the issue of maki...
捷配PCB打样 Talking
Getting Started with Freescale M4 K10 Development Using CodeWarrior 10.2
How to get started with Freescale M4 K10 development using CodeWarrior 10.2doubt:1. Does the Freescale M4 library mean that I am incomplete?2. How to port the Wildfire M4 library to CodeWarrior 10.2?3...
upc_arm NXP MCU
Stellaris Firmware 6852 (2011.01.11) Released
I made a routine inspection of some stations in the morning and found that Stellaris has been updated. The specific improvements can be found in the Release Note. It is probably an improvement in can ...
tomexou Microcontroller MCU
SOC Power Supply
The power supply solution for the LARK board uses a LT DCDC for the power supply of the LARK board, and the other power supplies of the FPGA use Enpirion DCDC. Enpirion is a company acquired by Altera...
烟波钓徒 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2726  34  589  2230  638  55  1  12  45  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号