MPAS-069-ZE-GT-11 datasheet, PDF

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MPAS-069-ZE-GT-11: DescriptionPGA69, IC SOCKET, ROHS COMPLIANT; CategoryThe connector socket; File Size633KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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MPAS-069-ZE-GT-11 Overview

PGA69, IC SOCKET, ROHS COMPLIANT

MPAS-069-ZE-GT-11 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Other features	ULTRA LOW INSERTION FORCE
Contact to complete cooperation	GOLD (30) OVER NICKEL
Contact completed and terminated	TIN OVER NICKEL/TIN OVER COPPER
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	PGA69
Shell material	GLASS FILLED POLYESTER
JESD-609 code	e3
Manufacturer's serial number	MPAS
Number of contacts	69

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F-210 SUPPLEMENT

(2,54mm) .100"

MPAS, MVAS, MSAS SERIES

MPAS–068–ZSGT–11

MPAS–144–ZSGT–13

PIN GRID ARRAY SOCKETS

Mates with:

MPAT, MVAT, MHAT, MSAT

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MPAS

or www.samtec.com?MVAS

BODY

STYLE

COUNT

LEAD

STYLE

PLATING

OPTION

PIN OUT

CODE

OPTION

MPAS

= Standard

Polyester

MVAS

= Open

Body Polyester

–“XXX”

= Total Number

of Filled

Positions

= 30µ" (0,76µm)

Gold Contact,

10µ" (0,25µm)

Gold Shell

–2

= (9,14).360

Wire-Wrap

(–ZW Only)

MPAS, MVAS

Insulator Material:

Black G.F. Polyester

Contact:

BeCu

Shell:

Brass except Style K

Phospher Bronze

Operating Temp Range:

-55°C to +105°C with Tin

-55°C to +125°C with Gold

Plating:

Au over 50µ"(1,27µm) Ni or

Sn over 100µ" (2,58µm) Cu or

50µ" (1,27µm) Ni

Current Rating:

Contact Resistance:

10mΩ max

Lead Size Range:

.015" (0,38mm) to

.022" (0,56mm) DIA

Insertion Force:

(Single contact only)

Style ZU = 1.5oz (0,42N) max,

all others = 2.5 oz (0,69N) avg,

5.5 oz (1,53N) max

Withdrawal Force:

(Single contact only)

Style ZU = 1.5oz (0,42N) max,

all others = 2.0 oz (0,56N) avg,

0.35 oz (0,97N) min

Lead-Free Solderable:

Wave, only

RoHS Compliant:

MSAS

= Hi-Temp LCP

Open Body

No. of Positions X .100 (2,54) SQ

ALSO AVAILABLE

= 30µ" (0,76µm)

Gold Contact,

Tin Shell

–3

= (6,60).260

Wire-Wrap

(–ZW Only)

(2,54)

.100

RoHS compliant

options.

Call Samtec.

–L

= Locking

Socket

(–ZS Only)

fre

w.sam

tec.com/lead-

= Tin Contact

and Shell

(Styles –ZS &

ZW Only)

= 10µ" (5,08µm)

Gold Contact,

Tin Shell

(Style –ZS only)

(7,62)

.300

(3,43)

.135

Requires GT

Plating Option

–ZW

= Wire Wrap

Shorter w/w

tail lengths

available.

See OPTION.

(4,90)

.193

(1,32)

.052

DIA

(0,76)

.030

–ZE

= Elevated

(0,76)

.030

(1,32)

.052

DIA

(13,77)

.542

(0,89)

.035

DIA

(0,51)

.020

DIA

Insertion Depth = .125" to .170"

Style ZE Component Part No. = EZ-2P3

(4,32)

.170

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

(12,95)

.510

(8,86)

.348

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MSAS

MSAS

Insertion Depth = .125" to .157"

Style ZW Component Part No. = EZ-1W1(1)

Style ZW-2 Component Part No. = EZ-1W1(2)

Style ZW-3 Component Part No. = EZ-1W1(3)

(0,64)

.025

Same as

MPAS except:

Insulator Material:

Black Liquid Crystal Polymer

Max Processing Temp:

230°C for 30 to 60 seconds

–ZS, –ZU, –ZA

= Printed Circuit

(0,76)

.030

LEAD

STYLE

DIA

(0,51)

.020

(0,51)

.020

TAIL

(3,18)

.125

(4,57)

.180

OAL

(7,62)

.300

(8,89)

.350

(1,32)

.052

DIA

Insertion Depth = .095" to .145",

Style ZS Component Part No. = EZ-1P1

Style ZA Component Part No. = EZ-6P1

Option L Component Part No. = SC-1L1 or EZ-1L1

–ZS, –ZU

–ZA

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

Locking lead (–L) available.

See OPTION.

WWW.SAMTEC.COM

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