NAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-CDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Output characteristics | OPEN-COLLECTOR |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| propagation delay (tpd) | 500 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 16 V |
| Minimum supply voltage (Vsup) | 10 V |
| surface mount | NO |
| Temperature level | OTHER |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| TSC395CL | TSC391CL | TSC391AL | TSC390AL | TSC390CL | |
|---|---|---|---|---|---|
| Description | NAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 | AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 | AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 | AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 | AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | CERAMIC, DIP-8 | CERAMIC, DIP-8 | CERAMIC, DIP-14 | DIP, |
| Contacts | 14 | 8 | 8 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | R-CDIP-T14 | R-CDIP-T8 | R-CDIP-T8 | R-CDIP-T14 | R-CDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of entries | 4 | 2 | 2 | 4 | 4 |
| Number of terminals | 14 | 8 | 8 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| Output characteristics | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| propagation delay (tpd) | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 16 V | 16 V | 16 V | 16 V | 16 V |
| Minimum supply voltage (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V |
| surface mount | NO | NO | NO | NO | NO |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | Microsemi | Microsemi | - | Microsemi | Microsemi |
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