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TSC391CL

Description
AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8
Categorylogic    logic   
File Size410KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

TSC391CL Overview

AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8

TSC391CL Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDIP
package instructionCERAMIC, DIP-8
Contacts8
Reach Compliance Codeunknown
JESD-30 codeR-CDIP-T8
JESD-609 codee0
Logic integrated circuit typeAND GATE
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature-30 °C
Output characteristicsOPEN-COLLECTOR
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)500 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)16 V
Minimum supply voltage (Vsup)10 V
surface mountNO
Temperature levelOTHER
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

TSC391CL Related Products

TSC391CL TSC391AL TSC395CL TSC390AL TSC390CL
Description AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 NAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP
package instruction CERAMIC, DIP-8 CERAMIC, DIP-8 DIP, CERAMIC, DIP-14 DIP,
Contacts 8 8 14 14 14
Reach Compliance Code unknown unknown unknown unknown unknow
JESD-30 code R-CDIP-T8 R-CDIP-T8 R-CDIP-T14 R-CDIP-T14 R-CDIP-T14
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type AND GATE AND GATE NAND GATE AND GATE AND GATE
Number of functions 2 2 2 2 2
Number of entries 2 2 4 4 4
Number of terminals 8 8 14 14 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -30 °C -30 °C -30 °C -30 °C -30 °C
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 500 ns 500 ns 500 ns 500 ns 500 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 16 V 16 V 16 V 16 V 16 V
Minimum supply voltage (Vsup) 10 V 10 V 10 V 10 V 10 V
surface mount NO NO NO NO NO
Temperature level OTHER OTHER OTHER OTHER OTHER
Terminal surface TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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