TSC390AL datasheet, PDF - EEWORLD Datasheet

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TSC390AL: DescriptionAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14; Categorylogic logic; File Size410KB，3 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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TSC390AL Overview

AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14

TSC390AL Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	DIP
package instruction	CERAMIC, DIP-14
Contacts	14
Reach Compliance Code	unknown
JESD-30 code	R-CDIP-T14
JESD-609 code	e0
Logic integrated circuit type	AND GATE
Number of functions	2
Number of entries	4
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	500 ns
Certification status	Not Qualified
Maximum supply voltage (Vsup)	16 V
Minimum supply voltage (Vsup)	10 V
surface mount	NO
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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TSC390AL Related Products

	TSC390AL	TSC391CL	TSC391AL	TSC395CL	TSC390CL
Description	AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14	AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8	AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8	NAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14	AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP
package instruction	CERAMIC, DIP-14	CERAMIC, DIP-8	CERAMIC, DIP-8	DIP,	DIP,
Contacts	14	8	8	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-CDIP-T14	R-CDIP-T8	R-CDIP-T8	R-CDIP-T14	R-CDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	NAND GATE	AND GATE
Number of functions	2	2	2	2	2
Number of entries	4	2	2	4	4
Number of terminals	14	8	8	14	14
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
propagation delay (tpd)	500 ns	500 ns	500 ns	500 ns	500 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	16 V	16 V	16 V	16 V	16 V
Minimum supply voltage (Vsup)	10 V	10 V	10 V	10 V	10 V
surface mount	NO	NO	NO	NO	NO
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	Microsemi	Microsemi	-	Microsemi	Microsemi

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